Micron
Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
RoleEngineering
LevelStaff
LocationFab 10A, Singapore, United States
WorkOn-site
TypeFull-time
Posted4 months ago
Benefits and perks
•Professional Development
•Comprehensive Health Dental And Vision Insurance
•401k Matching
•Competitive Salary And Equity Package
•Parental Leave
•Generous Paid Time Off And Holidays
Required skills
Python
JavaScript
TypeScript
About the role
As a Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering, you will be part of the Engineering team at Micron. You will work on challenging problems and contribute to the company's mission.
Responsibilities
- Mentor junior engineers and contribute to team growth
- Optimize application performance and reliability
- Design, develop, and maintain scalable software systems
- Participate in code reviews and contribute to engineering best practices
- Collaborate with cross-functional teams to define and ship new features
- Write clean, maintainable, and well-tested code
You may be a good fit if you
- Understanding of data structures and algorithms
- Excellent problem-solving and analytical skills
- Experience with modern software development practices
- Strong programming skills in one or more languages
Strong candidates may also have
- Open source contributions
- Experience with cloud platforms (AWS, GCP, Azure)
About Micron
Fab 10A
Headquarters