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トレンド企業

トレンド企業

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求人

Micron

Micron

Micron

Leading company in the technology industry

Memory Technology

Semiconductor Manufacturing

Storage Systems

Hardware Engineering

Boise, Idaho

10,001+

1978年設立(48年目)

ハイブリッド

Public

企業価値

$100B

累計調達額

$33M

直近ラウンド

Series A

MU

$455.07

売上高 (2026)

$0

営業利益

$0

募集中のポジション

1029件のポジション

DRAM Process Integration Engineer

Engineering

Boise, ID - Main Site

On-site

Mid-Level

Full-time

Senior Engineer - Manufacturing Engineering Planning

Manufacturing

Boise, ID - ID1

On-site

Senior

Full-time

Sr. Layout Engineer HBM

Engineering

Richardson, TX

On-site

Senior

Full-time

Principal Engineer Advanced Package Technology Development

Engineering

Boise, ID - Main Site

On-site

Staff

Full-time

Engineer, Firmware Development (SSD)

Embedded

MSB, Singapore

On-site

Mid-Level

Full-time

NY Construction Scheduling Lead

Project Management

Syracuse, NY - Downtown Office

On-site

Lead

Full-time

SR ENGINEER, OMT PROD. OEE

Manufacturing

2 Locations

On-site

Senior

Full-time

SR ENGINEER, OMT PROD. OEE

Manufacturing

Taichung - Fab 16; Taoyuan - Fab 11

On-site

Senior

Full-time

TSE Technician

Tech Support

Fab 10A, Singapore

On-site

Mid-Level

Full-time

OMT PROCESS ENGINEER

Engineering

Tainan, Taiwan

On-site

Mid-Level

Full-time

TECHNICIAN, TECHNICAL SUPPORT

Tech Support

Tainan, Taiwan

On-site

Mid-Level

Full-time

Process Integration Engineer

Engineering

Fab 10N/X, Singapore

On-site

Mid-Level

Full-time

SR ENGINEER - DEMQRA COMPUTE

Engineering

Taichung - Fab 16, Taiwan

On-site

Senior

Full-time

Recruitment Services Lead

HR

Taichung - Fab 16; Taoyuan - Fab 11

On-site

Lead

Full-time

Product Yield Enhancement Engineer

Engineering

Taichung - Fab 16, Taiwan

On-site

Mid-Level

Full-time

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Engineering

Fab 10A, Singapore

On-site

Mid-Level

Full-time

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Engineering

Fab 10A, Singapore

On-site

Mid-Level

Full-time

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Engineering

Fab 10A, Singapore

On-site

Mid-Level

Full-time

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Engineering

Fab 10A, Singapore

On-site

Mid-Level

Full-time

Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Engineering

Fab 10A, Singapore

On-site

Mid-Level

Full-time

終了したポジション

50件のポジション

Intern - PIE Yield Analysis (YA)

Fab 10N/X, Singapore

Intern

終了 4日前

Environmental Superintendent

Boise, ID - Main Site

Mid-Level

終了 4日前

Sr Thin Films Equipment Technician

Manassas, VA - Fab 6

Senior

終了 4日前

Thin Films Equipment Technician

Manassas, VA - Fab 6

Mid-Level

終了 4日前

RAM Quality Engineer

Boise, ID - Main Site

Mid-Level

終了 4日前

製品・サービス

CO

computer memory

Memory & Storage Hardware

DRAM Memory

DRAM Memory

Memory Solutions

NAND Flash Memory

NAND Flash Memory

Storage Solutions

Solid State Drives (SSDs)

Solid State Drives (SSDs)

Storage Solutions

Automotive Memory

Automotive Memory

Automotive Solutions

Mobile Memory Solutions

Mobile Memory Solutions

Mobile Solutions

Data Center Memory

Data Center Memory

Enterprise Solutions

Graphics Memory

Graphics Memory

Graphics Solutions

Embedded Storage

Embedded Storage

Embedded Solutions

3D XPoint Memory

3D XPoint Memory

Advanced Memory

Memory Cards

Memory Cards

Consumer Storage

総閲覧数

1,028

応募クリック数

0

模擬応募者数

0

スクラップ

0

レビュー

3.5

3件のレビュー

ワークライフバランス

2.0

報酬

4.0

企業文化

2.0

キャリア

4.0

経営陣

1.5

良い点

Good learning opportunities

High salary/good pay

Multiple positions available

改善点

Poor work-life balance

Excessive overtime

Management disagreements

給与レンジ

39件のデータ

Junior/L3

Mid/L4

Junior/L3

1件のレポート

$115,042

年収総額

基本給

$100,037

ストック

-

$115,042

$115,042

面接体験

4件の面接

難易度

2.8

/ 5

期間

2-5w

内定率

25%

体験

ポジティブ 25%

普通 25%

ネガティブ 50%

面接プロセス

1

Application Review

2

Recruiter/Phone Screen

3

Technical Interview

4

Final Round Interview

5

Offer

連絡先・所在地