Thermal Design Engineer, SI Hardware

What to Expect

Tesla AI Hardware team is revolutionizing artificial intelligence and looking for a highly motivated Thermal Design Engineer to cool the next generation of high-density AI data centers powered by Dojo – our custom supercomputer. We are looking for candidates of all experience levels for this opening. The role involves design and validation of air and liquid cooling solutions for AI hardware and cross functional collaboration on the full system design including chip package, PCBs, compute/network trays, rack and infrastructure. We will explore advanced cooling technologies to push the limits of compute density and system efficiency. A deep understanding of the fundamentals of fluid flow and heat transfer and ability to breakdown complex engineering problems into simple pieces that can be tackled by fundamentals is a must. Creative thinking, ability to solve complex and challenging problems, and ability to work independently are of paramount importance. This position involves working in a dynamic and fast-paced environment with tight timing and dynamic constraints.

What You’ll Do

• Design passive and active cooling solutions for high power AI electronics in compute tray
• Provide thermal inputs to the layout and design of the compute tray electronics and air/coolant delivery
• Drive component selection of thermal system from chip level (TIM, Heat Spreader, heatsink/coldplate) to tray level (fans, hoses, manifolds, QDs) to system level (CDU, Pump, Filter, Sensors)
• Design and optimize cooling solutions for performance, cost, reliability and risk
• Balance flow in complex flow networks at rack and compute tray levels by developing analytical and computational models of hydraulic and thermal systems
• Define thermal policy/ control algorithms and characterize system response at different scales
• Contribute to module- and system-level validation and reliability testing and data analysis including test plan , setup and debug

What You’ll Bring

• Degree in Thermal or Mechanical Engineering, or equivalent experience demonstrating exceptional ability in thermal management
• Minimum 2 years of industrial experience with evidence of exceptional performance
• Strong understanding of fundamentals of fluid mechanics, heat transfer, and thermodynamics
• Proficiency in numerical simulation of heat transfer and fluid flow
• Define thermal policy and control algorithms and characterize system response at different scales
• Experience in data centers liquid and air cooling of high-power GPU/ASICs, system flow balance and thermal control
• Knowledge of semiconductor packaging and package-level thermal/mechanical interactions