职位介绍
Responsibilities:
-
Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred.
-
Focus on process maintenance and improvement, new technology development, and continues yield improvement.
-
Collaboration with related departments including internal or external.
Qualifications:
-
Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines
-
Seniority less than 2 years.
-
Ability to speak and write in English fluently.
-
Good communication (Chinese and English) and emotion management..
-
Learning, innovation, fast-paced, and teamwork.
福利待遇
•Learning Budget
•弹性工作
•401k
•带薪假期
•眼科保险
必备技能
Manufacturing engineering
Process improvement
Technical documentation

我的简历能帮我拿到面试吗?
用 refresh.cv 查看简历评分和具体修改建议。
关于NXP Semiconductors
Kaohsiung
总部位置