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Principal DFT Engineer

NXP Semiconductors

Principal DFT Engineer

NXP Semiconductors

2 Locations

·

On-site

·

Full-time

·

1mo ago

Required skills

Python

We are looking for a Principal HW DFT Engineer who will architect, implement, and validate in-vehicle networking devices as part of NXP’s Automotive grade products. You will be responsible for advanced test strategies and implementation, verification and validation of pre/post tapeout of DFT features, overall test coverage improvements, and work closely with RTL and physical team on DFT timing constraints and closures.

Main Job Tasks and Responsibilities:

  • Architecture & Strategy: Define and implement advanced DFT strategies, including Scan Architecture, JTAG, Memory BIST (MBIST), and Logic BIST (LBIST)

  • Implementation & Verification: Lead the integration of digital subsystems, perform scan insertion, and generate ATPG (Automatic Test Pattern Generation) patterns while ensuring high fault coverage.

  • Silicon Support: Drive post-silicon validation and debug activities to root cause failures and improve manufacturing test efficiency.

  • Collaboration: Coordinate with physical design and test engineering teams to ensure timing closure and that test patterns are operational immediately upon silicon arrival.

Minimum Required Qualifications:

  • Education: B.S./M.S. Electrical/Computer Engineering (or similar degrees)

  • Experience: Typically requires 10+ years of industry experience in SoC DFT implementation, verification, static timing closure, test coverage analysis and improvement, and silicon bring-up on ATE

  • Tool Expertise: Proficiency with industry-standard EDA tools from Mentor Graphics/Siemens (Tessent), Cadence, or Synopsys

Technical Skills:

  • DFT - Scan insertion and architecture, ATPG: Proficiency in generating test vectors to detect manufacturing faults like stuck-at, transition, and advanced faults, Built-In Self-Test (BIST): Integration of Memory BIST (MBIST) for embedded SRAM/ROM and Logic BIST (LBIST) for autonomous logic testing, Boundary Scan & JTAG, Test Compression: Implementing techniques to reduce test data volume and application time, which is critical for large System-on-Chip (SoC) designs.

  • Hardware Design & Implementation

  • HDL Proficiency: Strong command of Verilog or System Verilog for modifying RTL to insert test logic and writing test wrappers. Timing & Constraints: Knowledge of Static Timing Analysis (STA) and creating DFT-specific timing constraints (SDC files) to ensure test logic does not degrade functional performance.

  • Verification & Debug

  • Simulation: Conducting gate-level simulations (GLS) and verifying DFT logic for correctness before fabrication. Post-Silicon Debug: Analyzing silicon data from Automated Test Equipment (ATE) to diagnose failures and improve manufacturing yield.

  • Software & Tool Proficiency

  • EDA Tool Suites: Mastery of industry-standard tools such as Synopsys TestMAX/DFT Compiler, Mentor Graphics Tessent, and Cadence Modus. Scripting & Automation: Expertise in Tcl, Python, or Perl to automate test insertion flows, run simulations, and parse coverage reports.

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About NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

Employees

Eindhoven

Headquarters

$45B

Valuation

Reviews

3.7

10 reviews

Work-life balance

3.5

Compensation

4.0

Culture

3.8

Career

3.2

Management

3.0

72%

Recommend to a friend

Pros

Supportive management and colleagues

Innovation and interesting technology

Good work-life balance and flexible hours

Cons

Management issues and poor communication

Limited career advancement and training

Heavy workload and long hours

Salary Ranges

227 data points

Junior/L3

L3

Intern

Junior/L3 · Data Scientist

0 reports

$114,000

total per year

Base

$99,000

Stock

-

Bonus

$15,000

$96,900

$131,100

Interview experience

42 interviews

Difficulty

3.1

/ 5

Duration

14-28 weeks

Offer rate

33%

Experience

Positive 69%

Neutral 13%

Negative 18%

Interview process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common questions

Technical skills

Past experience

Team collaboration

Problem solving