Key Responsibilities

• Assist in establishing and maintaining the Die Bond process
• Monitor daily production to ensure process stability, yield, and quality performance
• Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions
• Support new product introduction (NPI), including process setup, validation, and documentation
• Optimize process parameters to improve yield, efficiency, and reliability
• Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)
• Analyze data and prepare process reports
• Participate in continuous improvement projects (e.g., cost reduction, capacity increase)

Education & Qualifications

• Bachelor’s or Master’s degree in a related field, including:
• Materials Science
• Chemical Engineering
• Mechanical Engineering
• Electrical / Electronic Engineering
• Basic knowledge of semiconductor packaging processes is preferred
• Strong analytical and problem-solving skills
• Good communication skills and a team-oriented mindset
• English proficiency: TOEIC score of 650 or above, or equivalent certification

More information about NXP in Greater China...