Thermal Design Engineer, Datacenter Compute

What to Expect

Tesla is seeking a highly motivated Thermal Design Engineer for the Electronic Systems teams to help develop best in class cooling solutions from silicon to vehicles to datacenters. We are open to candidates of all experience levels for this opening.

The role involves design and validation of passive, active air-, and active-liquid cooling solutions for electronic systems, either for vehicle platforms or off-vehicle systems. The position requires working closely with cross-functional teams at different scales (silicon to system), as well as external suppliers. A deep understanding of the fundamentals of fluid flow and heat transfer and ability to breakdown complex engineering problems into simple pieces that can be tackled by fundamentals is a must.

Creative thinking, ability to solve complex and challenging problems, and ability to work independently are of paramount importance. This position involves working in a dynamic and fast-paced environment with tight timing and dynamic constraints.

What You’ll Do

• Design passive and active air and liquid-cooling solution for high power electronics - from silicon to vehicle to data centers
• Flow balancing in complex flow networks
• Develop analytical and computational models of hydraulic and thermal systems
• Drive component selection (Chiller, CDU, Fan, Pump, Filter, TIM)
• Optimize cooling solutions for all aspects of their performance and reliability
• Define thermal policy and control algorithms and characterize system response at different scales
• Drive validation and analyze data
• Contribute to module- and system-level reliability

What You’ll Bring

• Degree in Thermal/Mechanical Engineering, or equivalent experience
• Minimum 2 years of industrial experience with evidence of exceptional performance
• Strong understanding of fundamentals of fluid mechanics, heat transfer, and thermodynamics
• Proficiency in numerical simulation of heat and fluid flow
• Define thermal policy and control algorithms and characterize system response at different scales
• Experience in data centers is an asset
• Knowledge of semiconductor packaging and package-level thermal/mechanical considerations is an asset