We are looking for an experienced HW Engineer who has subject matter expertise in thermal management and thermal design of electronic enclosures. This engineer would be a key contributor in thermal related design work of telecom equipment.

You have:

• At least 5 years’ experience as a design, simulation, and/or test engineer, focused on thermal solutions
• Understanding heat transfer theories
• Proven skill set to use Computation Fluid Dynamics to evaluate passive and forced air-cooled solutions
• Proven ability to grasp new concepts and transform them into practical solutions
• Familiarity with thermal measurement technology and test tools such as temperature data logger, IR camera, air chamber, air speed meter etc.

It would be nice if you also had:

• Good mechanical aptitude with experience using power and hand tools found in a machine shop
• Bachelor’s degree mechanical engineering or related engineering degree. Master’s degree is plus
• Experience of Flotherm & Flotherm XT or other CFD analysis tool
• Prior experience in managing thermal aspects of electronic packaging
• Experience in the telecommunication, automotive, and/or aerospace industry is a plus
• Excellent verbal and written communication skills in English. Chinese is a plus

As part of the team, you will:

• Responsible for thermal design, simulation analysis, and test validation for radio products.
• Carry out thermal analysis at system level, board level, and component level with minimal to no support.
• Evaluate the Computation Fluid Dynamics (CFD) results using the heat transfer and thermodynamic principles, in conjunction with thorough comparison against analytical results.
• Review thermal setup and validate the CFD results with results from the tests carried out on manufactured products in experimental testing.
• Prepare technical reports and presentations with simulation plots, suggestions, and recommendations.
• Contribute towards ongoing internal research activities.
• Travel: up to 10%, domestic and international