Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The PKG Team plays a central role in package engineering for cutting-edge semiconductor products, especially mobile DRAM. Our team consistently supports the entire process from product concept to mass production ramp, with the mission of achieving high performance, reliability, and manufacturability by optimizing the chip and package together.Specifically, we lead package structure studies for new products and early evaluations, feasibility and risk assessments, and the preparation and release of technical documents. Through PKG reliability evaluations, we verify the validity of design, processes, and materials, and build a solid quality foundation for mass production. These activities are carried out in close collaboration with many related departments within the company.
Furthermore, the PKG Team is deeply involved in advanced technology development for Chip Package Integration (CPI) and next-generation nodes. Acting as a bridge between Fab processes and assembly processes, we conduct design rule checks, identify issues, and propose solutions to reduce risks in future technologies. For customer projects, we also handle package specification explanations, the provision of technical materials, and design and evaluation support based on customer requirements?contributing to business success from a technical perspective.
This position requires not only design and evaluation skills, but also strong technical decision-making, cross-functional coordination, and communication with global teams. For individuals who want to directly contribute to product competitiveness and next-generation technology through state-of-the-art packaging technology, the PKG Team offers significant growth opportunities and a highly rewarding environment.

1. Growth mindset.

2. Ability to work with a sense of ownership.

3. Advanced problem solving skills, including solving problems with customers.

4. Advanced knowledge of DRAM products.

5. Advanced knowledge of PKG.

6. Ability to think from multiple points of view.

7. Ability to identify low yield causes through systematic analysis.

8. Ability to work closely with many engineering groups to solve process/defect related issues.

9. Ability to think of new ideas.

10. Mentality to have comments honestly without bias.

11. Ability to communicate actively with others and solve problems while respecting each other.

12. Bachelor’s or master’s degree in electrical engineering, electronic engineering, materials engineering, mechanical engineering, or equivalent skills.

13. Knowledge and experience in PKG design and development.

14. High English communication skills in both speaking and writing.

15. Previous working experience in DRAM?related fields.

16. Japanese language skill is preferred because there are many chances to work with Japanese engineers.

-- Japanese --
PKG Teamはモバイル向けDRAMを中心とした最先端半導体製品において、パッケージエンジニアリングの中核を担うチームです。本チームは、製品コンセプト段階から量産立ち上げまでを一貫して支え、チップとパッケージを一体で最適化することで、性能・信頼性・量産性を高いレベルで実現することをミッションとしています。
具体的には、新製品や先行評価におけるパッケージ構成検討、技術検討・リスク評価、資料作成を主導します。また、PKG信頼性評価を通じて、設計・プロセス・材料の妥当性を検証し、量産に向けた品質基盤を構築します。こうした活動は、社内の多くの関連部門と密接に連携しながら進められます。
さらに、PKG Teamは、Chip Package Integration（CPI）や次世代ノードに向けた先行技術開発にも深く関与します。Fabプロセスとアセンブリプロセスの橋渡し役として、設計ルールの検証、課題抽出、対策立案を行い、将来技術のリスク低減に貢献します。顧客案件においては、パッケージ仕様説明や技術資料の提供、顧客要求に基づく設計・評価対応なども担当し、ビジネス成功を技術面から支えます。
このポジションでは、単なる設計・評価に留まらず、技術判断力、各部門間の横断的な調整力、グローバルチームとのコミュニケーション力が求められます。最先端パッケージ技術を通じて、製品競争力の向上と次世代技術の実現に直接貢献したい方にとって、PKG Teamは大きな成長機会とやりがいを提供する環境です。

1. Growth Mindset

2. 当事者意識を持って仕事に取り組む能力。

3. 高度な問題解決能力。顧客との問題解決能力も含みます。

4. 高度なDRAM製品知識。

5. 高度なPKG知識。

6. 多角的な視点で物事を考える能力。

7. 論理的な分析を通じて低歩留の原因を特定する能力。

8. さまざまなエンジニアリンググループと密接に連携して、プロセス/欠陥に関連する問題を解決する能力。

9. 新しいアイデアを考える能力。

10. 忖度なくコメントを言えるメンタリティ。

11. 周囲と積極的にコミュニケーションを取り、互いを尊重しながら課題解決に取り組める能力。

12. 電気工学、電子工学、材料工学、機械工学などの学士号/修士号または同等のスキル。

13. PKG設計/開発に精通している。

14. 口頭および書面による英語の高度なコミュニケーションスキルが必要です。

15. DRAMメモリ関連分野での以前の実務経験。

16. 日本のEngineerと一緒に仕事をする機会が多いので、日本語のスキルがあることが望ましいです。

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_japan@micron.com

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