Silicon Packaging Technology Engineer

Reality Labs is delivering Meta's vision through AI-powered wearable products. The compute performance, power efficiency, and form factor requirements demand custom silicon with cutting-edge packaging solutions. We are seeking a Silicon Packaging Technology Engineer to join our team and drive advanced packaging technology from concept through productization for next-generation consumer hardware.

Silicon Packaging Technology Engineer Responsibilities:

Lead development and roadmap creation for advanced and disruptive packaging technologies (hybrid bonding, TSV, fan-out, SiP, flip chip, SMT, solder ball attach, and assembly processes)
Establish and manage relationships with foundries, OSATs, substrate suppliers, and material suppliers to support package development activities
Influence and align OSAT and foundry partners' roadmaps with Meta's custom silicon packaging roadmap
Collaborate cross-functionally with internal teams (silicon design, architecture, system, thermal, mechanical) and external partners (design houses, OSATs, substrate vendors) to ensure manufacturability, integration, and reliability
Support test vehicle (TV) design, process feasibility, simulation, and design rule/DFM checks with emphasis on thermo-mechanical reliability
Drive Design of Experiments (DOEs) for initial builds, product qualification, and sustaining activities
Lead triage efforts for unexpected inline process, equipment, and quality issues; drive root cause failure analysis (FA) and corrective actions with partners
Evaluate and address chip-package interaction (CPI) effects, board-level reliability (BLR), and component-level reliability (CLR) through simulation, testing, and data analysis
Track technology gaps, reliability risks, and yield issues; compile and maintain POR, TOR, FMEA, and related KPIs
Stay updated on advanced packaging technologies and market trends and identify emerging technologies
Travel both domestically and internationally up to 10% of the time

Minimum Qualifications:

Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
12+ years of experience in advanced silicon packaging development, process integration, and manufacturing
Ability to work with mechanical and thermal constraints to co-optimize package architecture for demanding form factors
Demonstrated cross-functional collaboration with internal teams and external partners (foundry, OSAT, substrate vendors, ODMs)
Experience taking products from concept to prototyping and production, including manufacturing specifications, vendor qualifications, and yield/cost optimization
Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a relevant technical field

Preferred Qualifications:

Master's or PhD degree in a relevant engineering discipline
Experience with board-level and component-level reliability testing and qualification (JEDEC standards)
Strong DOE methodology, statistical data analysis, and process characterization skills
Experience driving failure analysis (FA) — including physical FA techniques, fault isolation, and root cause determination
Excellent problem-solving and communication skills; the ability to influence cross-functional stakeholders
Track record of successful complex package product qualification with OSATs
Experience with a broad range of packaging technologies: WLCSP, fan-out RDL, WoW, CoW, PoP, SiP, flip chip, and 3D stacking
Strong understanding of chip-package interaction (CPI), thermo-mechanical stress, and warpage management
Ability to work independently, manage multiple programs, and travel internationally (typically once per quarter)

About Meta

Meta builds technologies that help people connect, find communities, and grow businesses. When Facebook launched in 2004, it changed the way people connect. Apps like Messenger, Instagram and Whats App further empowered billions around the world. Now, Meta is moving beyond 2D screens toward immersive experiences like augmented and virtual reality to help build the next evolution in social technology. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today—beyond the constraints of screens, the limits of distance, and even the rules of physics.
For those who live in or expect to work from California if hired for this position, please click here for additional information.
United States of America: $212,000/year to $294,000/year + bonus + equity + benefits
Individual compensation is determined by skills, qualifications, experience, and location. Compensation details listed in this posting reflect the base hourly rate, monthly rate, or annual salary only, and do not include bonus, equity or sales incentives, if applicable. In addition to base compensation, Meta offers benefits. Learn more about benefits at Meta.

Equal Employment Opportunity:

Meta is proud to be an Equal Employment Opportunity employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, reproductive health decisions, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, political views or activity, or other applicable legally protected characteristics. You may view our Equal Employment Opportunity notice here.
Meta is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans in our job application procedures. If you need assistance or an accommodation due to a disability, fill out the Accommodations request form.
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