Quantum Interposer Integration Engineer

As a Silicon spin Interposer Process Integration Engineer, you will be responsible for integrating, optimizing, and sustaining end‑to‑end process flows required to manufacture superconducting interposers and advanced wafer‑level components in support of IBM’s silicon spin quantum computing efforts. This role is highly cross‑functional, requiring stronger hands‑on engagement with deposition, etch, lithography, bonding, and finishing technologies, along with the ability to characterize and model complex process flows for performance, yield, and throughput. You will collaborate closely with senior technical leadership and proactively coordinate with fabrication, metrology, and packaging teams to ensure stable, scalable, high‑quality manufacturing performance.

Essential Duties

• Collaborate with wafer‑level manufacturing teams to refine, mature, and technically guide superconducting interposer wafer flows.

• Develop, integrate, and refine post‑process flows for superconducting interposers, including deposition, etching, planarization, lithography, wafer dicing, and surface finishing.

• Selection of equipment and processes, and guiding the process of installing, qualifying and operating the required processes.

• Support and optimize various wafer bonding technologies and associated process flows to meet electrical, mechanical, and cryogenic performance targets.

• Develop advanced processes for shaping and finishing interposer components, enabling novel architectures and topologies.

• Perform process modeling and yield analysis to identify bottlenecks, optimize throughput, plan for tool utilization, and enhance overall manufacturing efficiency.

• Conduct hands‑on characterization and structured experimentation to validate process interactions, assess materials behavior, and drive resolution of integration‑related issues.

• Partner with metrology teams to define measurement plans, analyze data, and correlate process parameters with device‑level performance and yield.

• Collaborate with design, packaging, and manufacturing engineers to ensure process compatibility, cross‑team alignment, and timely execution against development and production milestones.

• Support documentation of process flows, integration strategies, equipment capability requirements, and troubleshooting methodologies.

• Communicate progress, risks, and key technical findings to senior management and provide coordination across cross‑functional engineering teams.