Entry Level Systems Thermal Modeler 2027 -Poughkeepsie, NY

As part of IBM’s hardware development organization, you will design, prototype, and validate next-generation compute systems by integrating expertise across mechanical, electrical, firmware, and materials engineering.

Your work may include:

• Developing and optimizing mechanical, thermal, and electrical components using CAD and CFD tools.
• Building and testing hardware prototypes, performing debug, failure analysis, and driving reliability and serviceability improvements.
• Modeling system-level thermal performance to enhance cooling, manufacturability, and efficiency.
• Applying design-of-experiments (DOE) methods to evaluate and improve processes, materials, and hardware designs.
• Supporting process and materials development, manufacturing readiness, and equipment IT integration within R&D environments.

You will have opportunities to work in areas such as:

• Thermal and mechanical modeling for air and liquid cooled systems

.