Hardware Developer Engineer Intern (Mechanical) 2027 - San Jose, CA

As a Mechanical Engineer at IBM, you will help design and build the hardware platforms that power the AI era, advanced computing, and the quantum revolution. You’ll work alongside a multidisciplinary team developing the mechanical systems, structures, and technologies that enable IBM’s industry leading infrastructure including IBM z Systems, IBM Power Systems, IBM Storage, and IBM Quantum.

Our Mechanical Engineers transform ideas into robust, manufacturable, high‑performance hardware. You’ll use your creativity, analytical skills, and engineering judgment to bring next‑generation products from concept through validation and into customer environments. Typical responsibilities include:

• Mechanical design and development of components, assemblies, and system‑level structures

• Thermal design, analysis, and testing, including heat transfer modeling, airflow optimization, and cooling solutions

• Structural and vibration analysis, materials selection, and reliability engineering

• Finite element modeling (FEM/FEA) for mechanical, thermal, or multiphysics simulations

• Microelectronics and system‑level packaging, including integration of processors, memory, power delivery, and high‑density interconnects

• Technology integration across electrical, thermal, mechanical, and manufacturing domains

• System and component characterization, test planning, and validation

• Manufacturability and assembly optimization, including tolerance analysis and DFMA principles

• Cross‑functional collaboration with electrical, firmware, and product engineering teams

• Field and customer engineering support, including root cause analysis of mechanical or environmental issues

• Product quality, reliability, and specification development

You will contribute to every stage of the hardware lifecycle concept development, modeling, prototype evaluation, environmental testing, reliability assessment, and product release.