Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:

Icheon-Gwango,KOR

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Key Responsibilities:

• Lead advanced packaging engagement with Korea customers (SK Hynix, SEC), building technical relationships and translating requirements into Fab Vantage solutions.
• Identify and resolve high-value process integration issues using Fab Vantage methodologies and data analytics tools (JMP, FSS, AIx).
• Develop and implement best practices for advanced packaging integration, enabling service opportunities (plating, hybrid bonding, CMP, CVD, PVD, etc.) and supporting AGS sales initiatives.
• Collaborate with process, hardware, metrology, and sensing teams to optimize module performance and troubleshoot complex issues.
• Document findings, prepare technical reports, and present solutions to internal and external stakeholders.

Required Skills & Expertise:

• Strong understanding of semiconductor backend and advanced packaging processes (HBM, 2.5D/3D integration).
• Proficiency in data analytics, DOE, and statistical tools (JMP); experience with AIx databases is a plus.
• Demonstrated ability to solve complex process issues, perform root cause analysis, and drive integration improvements.
• Excellent communication skills, including Korean language proficiency for customer engagement.
• Proven ability to work in cross-functional teams and customer-facing environments.

Qualifications:

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related field.
• 7+ years of experience in semiconductor or advanced packaging industries.
• Hands-on experience with advanced packaging process integration preferred.
• Based in or willing to relocate to Korea.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 50% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.