Company:

Qualcomm Semiconductor Limited:

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:Job Overview:

Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets for AI, IoT, Automotive. This team is responsible for roadmap, working with OSATs, IC substrate suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies.

This IC package substrate engineering role will focus on 2D/2.5D based chiplet technology development and next-generation substrate technologies used in advanced semiconductor packaging. The role requires IC substrate fine patterning, small via, new material knowledge and data analysis skill set.

Key Responsibilities:

• Responsible for QNM and Chiplet product introduction (NPI)

• Responsible for advanced MEP and SxS technology development (structure, design rule, material/machine)

• Responsible for chip-last RDL design rule set-up and new supplier enablement.

• Work with internal design team and drive DFM methodology for new technologies.

• Technical program management to plan, execute and monitor complex process or product developments.

• IC substrate supplier management for HVM capability improvement and quality control, troubleshooting with RMA handing.

Qualifications:

• Bachelor's degree in Material Science, Chemical, Mechanical, Electrical Engineering or related field.

• Staff Engineer: 10+ years of Package Engineering or related work experience.

Preferred Qualifications:

• Master's in Material Science/Chemical/Mechanical/Electrical Engineering.

• 12+ years of hands-on experience working in IC substrate manufacturing factory (FCBGA/FCCSP)

• Hands on experience working on substrate material factory or semiconductor packaging environment.

• Experience of development, high-volume manufacturing, troubling shooting of IC substrate (FCBGA/FCCSP)

• Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.

• Experience of Technical program management to plan, execute, and monitor complex process or product developments.

• Knowledge in DOE, control plan, FMEA and other statistical process control method.

• Proficiency in material and characterization data analysis, and statistical data analysis.

• Knowledge of reliability test methods and qualification procedure.

• Good oral and written communication skills, strong team player & project management skills.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR
  Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
  OR
  PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

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