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Qualcomm
Qualcomm

Inventing the technologies the world loves.

Technology Development Engineer

职能工程
级别中级
地点Wuxi, Jiangsu, China
方式现场办公
类型全职
发布4个月前
立即申请

必备技能

Project Management

Company:

Qualcomm China

Job Area:

Engineering Group, Engineering Group > Process Development Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Process Development Engineer, you will develop new or modified products, materials, and process formulations that meet and exceed customer expectations and enable cutting-edge, world class products. Qualcomm Engineers collaborate across functions and with externals customers to enhance the application of new product technology and manufacturing.

Minimum Qualifications:

  • Bachelor's degree in Engineering, Science, or related field and 4+ years of Product/Process Development or related work experience. OR
    Master's degree in Engineering, Science, or related field and 3+ years of Product/Process Development or related work experience.
    OR
    PhD in Engineering, Science, or related field and 2+ years of Product/Process Development or related work experience.

Tasks or Responsibilities:

  • New Packaging Technology Development for Advanced Package

  • Lead the new technology development for different packages for RF modules

  • Perform feasibility study on innovative technology concepts and provide module-level process solutions to meet desired package specification and process requirements.

  • Lead new process evaluation (incl. DoE), process qualification, implementation and manufacturing readiness

  • Define, select and qualify the equipment platforms to meet technical expectations, quality and capacity of new processes for high volume manufacturing ramp

  • Provide continuous improvement on package development, identify and renovate package for downsizing.

  • Project Management for comprehensive projects

  • Lead or participate projects for advanced package development to ensure all the engineering actives completed on time and on budget.

  • Be responsible for effective management of risks and dependencies while ensuring timely decisions are being made, ensuring the maturity of the process.

  • Have overall monitor and control on the project and product scope, cost, schedule and final deliverables for regular meetings with stakeholders.

  • Have regular communication with cross function teams and contract suppliers, demonstrate ability to communicate and present to all levels of management.

Required knowledge and skills:

  • Good experience in new IC package or process development

  • Min. 3 years’ experience on Compression Molding or SMT

  • Proven Project management in MNC

  • Be familiar with assembly process for semiconductor manufacturing

  • Be familiar with 6SIGMA, especially with Do

E and SPC methodology Required:

Education / Specialization:

  • B.S. in mechatronics, material or electronics engineering, M.S. preferred

  • Work effectively with a proactive mindset and be willing to accept challenges

  • Be fluent in both oral and written English.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Recruitment Statement:

  1. Job seekers are not required to pay us or Third Party Employment Agencies deposit, recruitment fees or other related fees for employment.

  2. We advocate the principle of equal employment and do not engage in any employment discriminations.

  3. We protect the employment rights of Hepatitis B surface antigen carriers in accordance with the law. New hires will not be tested for hepatitis B during the on-boarding physical examination.

  4. We do not employ child labor or forced labor, etc. to ensure freely chosen employment

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

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关于Qualcomm

Qualcomm

Qualcomm

Public

Inventing the technologies the world loves.

10,001+

员工数

San Diego

总部位置

$136B

企业估值

评价

3条评价

3.0

3条评价

工作生活平衡

3.0

薪酬

2.0

企业文化

2.5

职业发展

3.5

管理层

2.0

45%

推荐率

优点

Opportunity to work at reputable company

Interesting work and new skill development

Strong brand name recognition

缺点

Low compensation compared to market rates

Poor communication from employees

No benefits provided

薪资范围

21个数据点

Junior/L3

Junior/L3 · Data Scientist

0份报告

$196,000

年薪总额

基本工资

$150,000

股票

$33,000

奖金

$13,000

$166,600

$225,400

面试评价

8条评价

难度

2.8

/ 5

时长

14-28周

面试流程

1

Application Review

2

Recruiter Screen

3

Technical Phone Screen

4

Onsite/Virtual Interviews

5

Team Matching

6

Offer

常见问题

Coding/Algorithm

Technical Knowledge

System Design

Behavioral/STAR

Past Experience