Company:

Qualcomm Semiconductor Limited:

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging technology development and new product introduction (NPI) of leading-edge package technologies for Mobile, Automotive, IOT, High Performance Computing and new emerging markets and driving that innovation into high volume manufacturing at OSATs. Extensive knowledge and experience are required in bumping, wafer level package (WLP), fan-out wafer level package (FOWLP), fan-out panel level package (FOPLP), and 2.5D RDL process, materials, equipment, reliability, and design rules. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Management and integration lead experience will be a plus.

Duties and Responsibilities:

• Responsible for exploring, development and HVM deployment of bumping, WLP, FOWLP, FOPLP, 2.5D RDL packaging technologies.
• Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
• Interface with OSATs, material suppliers, and equipment makers in developing technology related to product requirements. Align with internal product teams on design rules and its establishment.
• Drive continuous process improvements on process capability, yield, reliability, and quality.
• Associate with internal design team and drive DFM methodology for new technologies.
• Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.
• Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.
• Good understanding of FMEA, SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.
• Produce breakthrough ideas and translate them into packaging solutions.

Preferred Qualifications:

• 10+ years of experience in the development and high-volume manufacturing of advanced IC packages.
• Expertise in bumping, WLP, FOWLP, FOPLP, 2.5D RDL packaging materials, assembly processes, equipment, reliability, and design rules.
• Excellent verbal and written communication skills.
• Exhibit organized technical project management skills.
• Able to work independently and lead multiple programs.
• Able to lead multi-functional teams to solve complex technical problems.
• Self-driven, passionate, and creative.
• Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.
• Experience in working with OSATs or major foundry packaging teams.
• Process integration experience in taking semiconductor packaging products from development to HVM.
• Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.
• Proficiency in material and package characterization and statistical data analysis.
• Familiar with JEDEC component & board level reliability testing methods and qualification procedure.
• Six Sigma Green or Black belt a plus.

Educational Requirements:

• Preferred: Master's degree or Ph.D. in Mechanical Engineering, Materials Science & Engineering, Chemical Engineering, Electrical Engineering, or related engineering field.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR
  Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
  OR
  PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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