Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm’s Hardware Systems organization is seeking a seasoned Thermal Engineer to join our team. The qualified individual will be creating innovative solutions resolving complex thermal management challenges supporting Automotive applications. He/She will apply analytical and empirical skills on the development of advanced thermal architecture solutions for Automotive chipsets and their hosting platforms.

Responsibilities:

• Perform package and system-level thermal modeling to design best in class thermal solutions.
• Support thermal/mechanical projects from concept to production phase.
• Design, set up, run, and deliver results for various thermal experiments to validate performance of hardware.
• Manage technical projects and collaborate with other internal organizations and OEMs/ODMs to support the execution process throughout development cycle.
• Perform thermal simulations and tests and prepare and present results to stakeholders from various disciplines.

Skills/Experience:

• 8+ years of industry experience in electronics cooling preferably related to Automotive applications.
• Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.
• Skillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.
• Ability to write scripts and data analysis. Programming experience with Python, C/C++.
• Debugging and bring up experience, in addition to operating data acquisition equipment required.
• Ability to design thermal tests and execute per plan within a laboratory environment.
• Must have experience with selection of thermal management materials.
• In-depth understanding of natural, forced convection, and liquid cooling. Exposure to cooling systems related to Automotive industry is a plus.
• Must have thermal design experience with PCBs, enclosures, and heat sinks.
• Some experience with 3D geometry CAD tools such as Solidworks or Creo.
• Excellent presentation, negotiation, and communication skills

Education Experience:

MSME or Ph

D in Mechanical Engineering:

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Pay range and Other Compensation & Benefits:

$180,400.00 - $270,600.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.