招聘
Micron
Micron
Leading company in the technology industry
Memory Technology
Semiconductor Manufacturing
Storage Systems
Hardware Engineering
开放职位
1029个职位
DRAM Process Integration Engineer
Engineering
Boise, ID - Main Site
On-site
Mid-Level
Full-time
4天前
Senior Engineer - Manufacturing Engineering Planning
Manufacturing
Boise, ID - ID1
On-site
Senior
Full-time
4天前
Sr. Layout Engineer HBM
Engineering
Richardson, TX
On-site
Senior
Full-time
4天前
Principal Engineer Advanced Package Technology Development
Engineering
Boise, ID - Main Site
On-site
Staff
Full-time
4天前
Engineer, Firmware Development (SSD)
Embedded
MSB, Singapore
On-site
Mid-Level
Full-time
4天前
NY Construction Scheduling Lead
Project Management
Syracuse, NY - Downtown Office
On-site
Lead
Full-time
4天前
SR ENGINEER, OMT PROD. OEE
Manufacturing
2 Locations
On-site
Senior
Full-time
4天前
SR ENGINEER, OMT PROD. OEE
Manufacturing
Taichung - Fab 16; Taoyuan - Fab 11
On-site
Senior
Full-time
4天前
TSE Technician
Tech Support
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
OMT PROCESS ENGINEER
Engineering
Tainan, Taiwan
On-site
Mid-Level
Full-time
4天前
TECHNICIAN, TECHNICAL SUPPORT
Tech Support
Tainan, Taiwan
On-site
Mid-Level
Full-time
4天前
Process Integration Engineer
Engineering
Fab 10N/X, Singapore
On-site
Mid-Level
Full-time
4天前
SR ENGINEER - DEMQRA COMPUTE
Engineering
Taichung - Fab 16, Taiwan
On-site
Senior
Full-time
4天前
Recruitment Services Lead
HR
Taichung - Fab 16; Taoyuan - Fab 11
On-site
Lead
Full-time
4天前
Product Yield Enhancement Engineer
Engineering
Taichung - Fab 16, Taiwan
On-site
Mid-Level
Full-time
4天前
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineering
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineering
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineering
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineering
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Engineering
Fab 10A, Singapore
On-site
Mid-Level
Full-time
4天前
已关闭职位
50个职位
Intern - PIE Yield Analysis (YA)
Fab 10N/X, Singapore
Intern
已关闭 4天前
Environmental Superintendent
Boise, ID - Main Site
Mid-Level
已关闭 4天前
Sr Thin Films Equipment Technician
Manassas, VA - Fab 6
Senior
已关闭 4天前
Thin Films Equipment Technician
Manassas, VA - Fab 6
Mid-Level
已关闭 4天前
RAM Quality Engineer
Boise, ID - Main Site
Mid-Level
已关闭 4天前
产品与服务
CO
computer memory
Memory & Storage Hardware
DRAM Memory
Memory Solutions
NAND Flash Memory
Storage Solutions
Solid State Drives (SSDs)
Storage Solutions
Automotive Memory
Automotive Solutions
Mobile Memory Solutions
Mobile Solutions
Data Center Memory
Enterprise Solutions
Graphics Memory
Graphics Solutions
Embedded Storage
Embedded Solutions
3D XPoint Memory
Advanced Memory
Memory Cards
Consumer Storage
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新闻动态
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Lobbying Update: $800,000 of MICRON TECHNOLOGY INC. lobbying was just disclosed - Quiver Quantitative
Quiver Quantitative
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4天前
If You Had Bought $1,000 of Micron Technology at Its IPO, Here's How Much You Would Have Today (Try Not to Cry) - 24/7 Wall St.
24/7 Wall St.
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4天前
Insider trades: Tim Cook shops Nike shares; Micron, Broadcom among other notable names (NKE:NYSE) - Seeking Alpha
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News
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The Motley Fool
News
·
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Can Sandisk Catch Micron? - Yahoo Finance
Yahoo Finance
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4天前
更多 (剩余15条)
总浏览量
1,028
申请点击数
0
模拟申请者数
0
收藏
0
评价
3.5
3条评价
工作生活平衡
2.0
薪酬
4.0
企业文化
2.0
职业发展
4.0
管理层
1.5
优点
Good learning opportunities
High salary/good pay
Multiple positions available
缺点
Poor work-life balance
Excessive overtime
Management disagreements
薪资范围
39个数据点
Junior/L3
Mid/L4
Junior/L3
1份报告
$115,042
年薪总额
基本工资
$100,037
股票
-
$115,042
$115,042
面试经验
4次面试
难度
2.8
/ 5
时长
2-5w
录用率
25%
体验
正面 25%
中性 25%
负面 50%
面试流程
1
Application Review
2
Recruiter/Phone Screen
3
Technical Interview
4
Final Round Interview
5
Offer
联系方式与地址