
Leading company in the technology industry
Intern 2026- HIG PSE
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our vision is to transform how the world uses information to enrich life forall.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements.
其他職務說明
As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
Key Responsibilities
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Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
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Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations.
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Driving Cumulative Yield Ownership with cross functional teams and drive initiatives for overall Yield and Quality Improvement.
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Qual/Package Qual and RMA Packaging Related Issues.
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Front End and Back End Process Conversions: Work with FAB, TD, APTD, PDE Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products.
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Data Analysis for Yield Improvement and Reliability: Utilizing in-house statistical tools/machine learning/AI for engineering data analysis to improve yields and reliability and implement within the Dispo workflow.
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Create a deviation alert system for yield loss, char/param trend, wafer/die/cube shading.
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Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
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Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.
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Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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Micronについて

Micron
PublicMicron Technology is a global leader in memory and storage solutions, manufacturing DRAM, NAND flash memory, and solid-state drives for computing, mobile, automotive, and data center applications.
10,001+
従業員数
Boise
本社所在地
$100B
企業価値
レビュー
10件のレビュー
3.6
10件のレビュー
ワークライフバランス
2.8
報酬
3.5
企業文化
4.1
キャリア
2.7
経営陣
3.0
65%
知人への推奨率
良い点
Supportive management and great team culture
Excellent health benefits and compensation
Cutting-edge technology and interesting projects
改善点
Long hours and heavy workload
High pressure environment leading to burnout
Limited career advancement opportunities
給与レンジ
37件のデータ
Junior/L3
Mid/L4
Junior/L3 · Business Intelligence Analyst
1件のレポート
$115,042
年収総額
基本給
$100,037
ストック
-
ボーナス
-
$115,042
$115,042
面接レビュー
レビュー4件
難易度
2.8
/ 5
期間
14-28週間
内定率
25%
体験
ポジティブ 25%
普通 25%
ネガティブ 50%
面接プロセス
1
Application Review
2
Recruiter/Phone Screen
3
Technical Interview
4
Final Round Interview
5
Offer
よくある質問
Coding/Algorithm
Technical Knowledge
Behavioral/STAR
Past Experience
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