Build, maintain, and operate cryogenic test apparatuses, fixtures, and mounts for production screening and experimental prototyping.

Collect and analyze Vector Network Analyzer (VNA) data to characterize device performance.

Prepare and assemble Printed Circuit Boards (PCBs) and die using specialized fixturing.

Test electrical performance of components and support failure analysis by determining root causes and corrective actions.

Operate tools for metal deposition, lithography, etching, and device characterization.

Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.

3 years of experience with electronics packaging, including printed circuit boards (PCBs), wire bonding, or die preparation.

Experience with hardware solder assembly processes (e.g., IPC J-STD-001).

Experience using optical and electrical inspection equipment (e.g., voltmeters, microscopes, or oscilloscopes).

Experience with metal cutting techniques.

Experience working with electrostatic discharge (ESD) sensitive devices.