Figure is an AI robotics company developing autonomous general-purpose humanoid robots. The goal of the company is to ship humanoid robots with human level intelligence. Its robots are engineered to perform a variety of tasks in the home and commercial markets. Figure is based in San Jose, CA and require 5 days/week in-office collaboration.

We are seeking a Systems Integration Engineer – Head Subsystem to lead the bring-up, integration, and validation of the robot’s head electronics. You will own electrical integration from early prototypes through full-robot and production builds, ensuring robust power delivery, signal integrity, thermal performance, and system reliability.

Key Responsibilities:

• Lead electrical bring-up and system integration of the head subsystem across embedded compute, power regulation, sensing, display, audio, and communication interfaces.

• Plan and execute subsystem and system-level validation of power delivery, high-speed interfaces (USB, Display Port, MIPI, PCIe, Ethernet, SGMII), RF, and thermal performance.

• Develop and execute electrical validation plans covering power integrity, signal integrity, EMI susceptibility, and thermal behavior.

• Debug complex cross-disciplinary issues across hardware, firmware, and software using telemetry, oscilloscopes, DAQs, logic analyzers, and other lab instrumentation.

• Drive integration of power architectures, grounding strategies, and interface definitions to ensure reliable operation in a compact, high-density electromechanical assembly.

• Analyze system data and define KPIs to track electrical performance, reliability, and fleet health over time.

• Document bring-up procedures, validation workflows, test results, and integration learnings to support scaling to production and manufacturing test.

Requirements:

• Bachelor’s in Electrical or Systems Engineering (or equivalent experience).

• 4–8+ years of experience in electrical systems integration, validation, or test for embedded or robotic systems.

• Strong understanding of power systems, power regulation, grounding, and signal integrity in embedded compute platforms.

• Experience with high-speed digital and communication interfaces (USB, PCIe, Ethernet, MIPI, Display Port).

• Hands-on experience with electrical and thermal validation using oscilloscopes, DAQs, power analyzers, and thermal instrumentation.

• Proficiency in Python for automation, scripting, and data analysis; familiarity with C++ a plus.

• Strong debugging, documentation, and cross-functional collaboration skills.

Preferred Experience:

• Experience integrating embedded compute, displays, RF, or audio systems in robotics, automotive, aerospace, or consumer electronics.

• Background in EMI/EMC testing, mitigation, or compliance support.

• Experience with thermal management and cooling strategies in dense electronic assemblies.

• Familiarity with manufacturing bring-up, factory test development, or sustaining engineering.

• Willingness to travel occasionally for on-site integration or manufacturing support.

The US base salary range for this full-time position is between $150,000 and $250,000 annually.

The pay offered for this position may vary based on several individual factors, including job-related knowledge, skills, and experience. The total compensation package may also include additional components/benefits depending on the specific role. This information will be shared if an employment offer is extended.