At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

• Position Description
• Would work for product validation of Sigrity tools.
• Would work for product validation of simulation-related flows in Integrity 3DIC, Allegro, etc.
• Working closely with PE (Product Engineering) and R&D for new features/enhancements.
• Participate in project plans and functional specifications, develop test criteria, and write test plans.
• Assuring the quality of tools by analyzing existing test suites.
• Validating code changes and integrating customer cases as part of the regression test suite.

Requirements:

• Education & Experience: Freshman with MSEE (Master of Science in Electrical Engineering) or 3 years’ experience with BSEE are preferred.
• Technical Background: Solid background in high-speed circuit, electromagnetics, and microwave engineering.
• Knowledge of PCB, advanced packaging, and 3DIC design, simulation, and signoff.
• Familiar with 3D/2.5D/2D electromagnetics and SPICE simulation tools.
• Skills & Programming: Working experience with UNIX and knowledge of Shell/Tcl scripting languages.
• Familiarity with Perl and/or Python is a plus.
• Excellent oral and written communication skills.
• Soft Skills: Should be able to work independently and have adequate personality & communication skills to cooperate with cross-functional groups.Position Description
• Would work for product validation of Sigrity tools.
• Would work for product validation of simulation-related flows in Integrity 3DIC, Allegro, etc.
• Working closely with PE (Product Engineering) and R&D for new features/enhancements.
• Participate in project plans and functional specifications, develop test criteria, and write test plans.
• Assuring the quality of tools by analyzing existing test suites.
• Validating code changes and integrating customer cases as part of the regression test suite.

Requirements:

• Education & Experience: Freshman with MSEE (Master of Science in Electrical Engineering) or 3 years’ experience with BSEE are preferred.
• Technical Background: Solid background in high-speed circuit, electromagnetics, and microwave engineering.
• Knowledge of PCB, advanced packaging, and 3DIC design, simulation, and signoff.
• Familiar with 3D/2.5D/2D electromagnetics and SPICE simulation tools.
• Skills & Programming: Working experience with UNIX and knowledge of Shell/Tcl scripting languages.
• Familiarity with Perl and/or Python is a plus.
• Excellent oral and written communication skills.
• Soft Skills: Should be able to work independently and have adequate personality & communication skills to cooperate with cross-functional groups.

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