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Job Description:
Broadcom is searching for an ASIC top level floorplan Physical Design Engineer to join the Asic Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and PCIe Switch Products. More specifically, this position will require in-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tapeout.
Responsibilities:
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Own chip floor planning, partition creation, clock tree and delivery of top level partitions
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Resolve physical design issues related to chip integration and assembly
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Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team
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Develop and improve floorplan methodologies using both industry and internal tools
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Perform technical evaluations of IPs, providing recommendations and assessments to meet design specification
Preferred qualifications:
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Bachelors and 8+ years of experience in top level floorplanning with a focus on die size estimate, partitioning, clocking and pin assignment, or
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Master's degree in Electrical Engineering and 6+ years of experience in top level floorplanning with a focus on die size estimate, partitioning, clocking and pin assignment
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Experience working on various technologies (Switch Fabric, Arbiter, High Speed DDR, Ser Des, HBM, D2D I/O, chiplet etc)
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Experience in resolving chip level DRC/LVS/EMIR issues for advance nodes and tape out experience
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Proven track record with bump planning, RDL routes and multi voltage domain designs
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Experience with hierarchical design planning, power grid design, structured clocks, top level pipeline placement, custom routes and bump planning
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Experience in collaborating with design, package and methodology teams during development phase
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Experience in scripting languages like Python, Tcl, or Perl
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Must work in person at our San Jose site and no remote work allowed
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $120,000 - $192,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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About Broadcom
Reviews
3.0
10 reviews
Work Life Balance
2.2
Compensation
4.1
Culture
2.3
Career
1.8
Management
2.1
25%
Recommend to a Friend
Pros
Good pay and compensation
Quality benefits package
Equity/RSUs offered
Cons
No career advancement opportunities
Poor management quality and leadership
Frequent layoffs and job insecurity
Salary Ranges
1,961 data points
Mid/L4
Mid/L4 · Infrastructure Engineer
1 reports
$219,086
total / year
Base
$168,682
Stock
-
Bonus
-
$219,086
$219,086
Interview Experience
2 interviews
Difficulty
3.0
/ 5
Duration
14-28 weeks
Experience
Positive 0%
Neutral 50%
Negative 50%
Interview Process
1
Interview
2
Multiple rounds
News & Buzz
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Source: The Motley Fool
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Source: AD HOC NEWS
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·
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