Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X).

Job duties include but not limited to:

• Responsible IC package and module design. Work with cross-functional team to develop advanced IC packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.
• Support system-level structural design, stress evaluation, and thermal simulation.
• Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification.
• Document manufacturing process flows and control plans for IC packages at company’s external suppliers.
• Support root cause analysis for assembly factors, optical coupling, optical loss, and reliability failures.
• Collaborate with internal stakeholders and external manufacturers to achieve deliverables per project stage.

Minimum Qualifications:

• Master’s degree or above in Mechanical Engineering, Microelectronics, Electronics Packaging, Material Science, Optical Engineering, or related fields

• Familiar with packaging technologies (PCBA, module assembly, optoelectronic co-packaging, precision bonding, etc.), with practical project experience preferred.

• Proficient in mechanical design software (such as Solid Works, Creo) with capabilities in structural design and precision assembly analysis

• Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

• Prior industry working experience or internship in IC package, power module, or co-packaged optical module assembly would be distinct advantage.

• Hand-on experience with thermal simulation tools (COMSOL, Ansys Icepak, Flotherm, etc.), capable to analyze thermal distribution, temperature drift impacts, and cooling solutions.

• Experience with optical design tools (such as Zemax, CodeV, Lumerical, FDTD) and being capable of optical path design, coupling simulation, and tolerance analysis is a plus.

• Basic understanding of silicon photonics platforms, optical devices (laser, modulator, detector, multiplexer, etc.), and coupling methods is a plus.

• Proficient in English.

• For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S.

Department of Commerce:

• Bureau of Industry and Security and/or the U.S.

Department of State:

• Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Graduate Job

Required Travel: Yes, 10% of the time