Sr. Mechanical Design Engineer, Power Semiconductor Packaging

What to Expect

As a Mechanical Design Engineer for Power Semiconductor Packaging, you won’t just follow industry standards—you’ll set them. Tesla has already revolutionized power discrete and module, making our designs the global gold standard. Forget the constraints of traditional "off-the-shelf" outlines, you will use a first-principles approach to design custom packaging for our next-generation vehicle and energy products. Your scope is end-to-end: from sketching the first concept to overseeing high-volume mass production. You will create novel, world-class packaging solutions that solve complex structural, thermal, and electrical challenges. Drive prototype builds, rigorous engineering testing, and final validation. Work within a fast-paced, multi-disciplinary team that blends mechanical, thermal, and electrical engineering.

What You’ll Do

• Develop Tesla custom power semiconductor packages (e.g., discrete and module) for electric vehicle and energy storage products utilizing SiC/ Gan/ or Si technology as well as developing novel cooling and attachment methods for Power Electronics applications
• Lead package development efforts and collaborate with electrical architecture teams as well as product design team to define requirements, performance and qualifications plans
• Conduct root cause analysis of failures with coordination from failure analysis and reliability teams to improve design and enhance package reliability
• Conduct Multi-physics simulations to extract parasitic resistance/inductance/capacitance and thermal resistance stacks of semiconductor packages to develop fast-switching and low-loss design to maximize system reliability
• Perform lab evaluation and sample construction using hand tools or semi-manual equipment
• Deliver technical writing, presentation and training sessions

What You’ll Bring

• Master's Degree in Mechanical Engineering or Power Electronics Engineering focusing on semiconductor packaging, or equivalent experience
• Minimum 3 years of industry experience of semiconductor packaging design and development
• Extensive knowledge of various manufacturing techniques, including die bonding, wire bonding, solder dispensing & printing, reflow, plasma cleaning, encapsulation, plating, stamping, die-casting, injection molding, fastening/joining, and automated assembly processes, to ensure designs are productionable. As well as familiarity with PCBAs and their components
• Proficiency in multi-physics simulation ranging from thermal, electrical, mechanical, and magnetic design. Finite element analysis (FEA) tools like ANSYS Workbench, Icepak, Q3D, CFD
• Proficiency in 2D/3D CAD drawing using CATIA V5/V6, Solidworks, AutoCAD
• Deep understanding of packaging materials, processes, failure modes, failure analysis approaches, and qualification standards for automotive products
• Basic understanding of power device physics, power electronic circuits, and high-voltage insulation
• Strong knowledge of tolerance stacks, design for manufacturing (DFM), design for test (DFT), and design for reliability
• Strong technical writing and presentation skills