IC Package Substrate Engineer

What to Expect
The Tesla AI Hardware team is at the forefront of revolutionizing artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI chips tailored to accelerate Tesla’s machine learning capabilities. Their work powers the neural networks behind Full Self-Driving (FSD), and Tesla humanoid robot, Optimus, pushing the boundaries of computational efficiency and performance. By creating custom silicon and optimized architectures, the team ensures Tesla remains a leader in AI-driven automotive and energy solutions, shaping a future where intelligent machines enhance human life.
Tesla’s AI Hardware team is looking for a highly motivated IC Package Substrate Engineer who will be part of an IC packaging team responsible for packaging substrates for Tesla’s AI chip programs. This role involves IC package substrate development for different system applications including driving substrate process optimization/ characterizations, substrate and package level test, data analysis and NPI/MP of new package substrates. A successful candidate will have a strong background in IC package substrate engineering and be able to thrive in a highly dynamic environment.

What You’ll Do

• Drive substrate technology development to meet yield target and stringent reliability requirement for automotive SoC and other product segments
• Identify and qualify substrate vendors for different products by defining clear strategy/roadmap and driving qualification data collection to meet schedule for product launch
• Solve substrate process/material related technical issues by working with substrate vendors and internal teams closely
• Drive substrate process solutions for chip-packaging interaction issues
• Perform comprehensive substrate yield analysis and drive yield improvement at substrate vendors
• Support substrate technology development to high volume manufacturing transition to ensure smooth product launch
• Drive substrate pathfinding for future product needs

What You’ll Bring

• Master's Degree in related field or equivalent experience plus 2+ years’ experience in IC packaging substrate field
• Excellent engineering problem solving skills with strong physics/fundamentals and excellent project management skills
• Good experience on IC package architecture and assembly process/material
• Must have deep understanding and knowledges on IC packaging substrate process, materials, design rules and qualification methodology
• Strong experience on working with internal and external x-functional teams