Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Are you passionate about scaling AI deployment through enhancing energy efficiency of RISC-V based CPUs and AI Data Centers? Would you like to be part of Open Chiplet Architecture to bring architectural flexibility tailored towards making our customers' experience great with low cost product solutions that are simpler, faster, and open? Are you an expert in Power Management and Optimization of So Cs and Chiplets? Do you enjoy working in a fast paced technical environment with multi-disciplinary teams of smart engineers to tackle the challenging energy efficiency of Data Center Products? At Tenstorrent, we own our Silicon future and provide a comprehensive solution through making our own IPs, Chiplets. Chips, Boards, and Systems. If you said yes to the above questions, we want to work with you.

This role ishybrid based out of Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• A hands-on expert in Power Management and SoC Power Architecture, with proven experience in data center power optimization.

• Skilled at debugging, experimentation, and root cause analysis, thriving in fast-paced, technically challenging environments.

• A strong collaborator and communicator, comfortable working with multidisciplinary teams across silicon, firmware, and systems.

• Passionate, optimistic, and driven to make bold contributions that push the boundaries of AI hardware.

• Committed to execution and impact — you enjoy doing, not just talking, and are motivated to leave your mark on the future of AI.

What We Need

• Deep expertise in Power Management, SoC Power Architecture, Power Delivery Networks, Thermal Analysis, and Performance Trade-offs

• Proficiency in Power Estimation Methodologies (e.g., using PTPX inputs) and trade-off modeling

• Experience with silicon PVT corners, process node trade-offs, binning, voltage droop mitigation techniques

• Ability to analyze AI and ML workloads for performance and efficiency

• Strong debugging skills and ability to design experiments to root cause issues

• Great interpersonal and collaboration skills to work with diverse engineering teams

What You Will Learn

• Hands-on experience working on the cutting edge of AI hardware design—from chiplets to full systems

• Exposure to Open Chiplet Architecture and the chance to contribute to industry-shaping standards like OCMI

• Opportunities to collaborate across Silicon, Firmware, and System teams, solving some of the most complex energy efficiency challenges in data centers

• A front-row seat to the scaling of AI through RISC-V–based solutions, shaping products that are simpler, faster, and more open

• The chance to leave your mark on the future of AI with a team that values bold ideas, fast execution, and long-term impact

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.