Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

We are seeking a Package Design Engineer with hands-on experience in Organic and Advanced 2.5D/3D Chiplet packaging. The ideal candidate is proactive, technically curious, and driven to improve design velocity through SIPI-aware methodologies, AI automation, and strong cross-functional collaboration.

This role is hybrid, based out of Toronto, ON or Taipei City, TW.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• Seasoned Package Design Engineer with hands-on experience in Organic and Advanced 2.5D/3D chiplet packaging.

• Experience owning placement and routing of Tenstorrent packages, including organic substrates and 2.5D interposers.

• Optimize routing, stack-ups, and design methodologies for emerging package technologies.

• Support layout verification, design rule checking (DRC), and overall package sign-off activities.

• Drive supplier engagement to develop new capabilities and continuous process improvements ahead of program needs.

• Create and maintain engineering documentation, including design rules, design intent, and BOM definition to ensure clear technical communication across teams.

What we need

• BS/MS in Mechanical/Electrical Engineering with 5+ years experience in layout and routing of 2.5D packages (Co WoS-S, -L, -R).

• Previous ownership of FCBGA package verification and tapeout (DRC/LVS, sign-off processes).

• Demonstrated ability to collaborate effectively with cross-functional engineering teams and external suppliers.

• Proficiency with automation and scripting (Python, TCL, SKILL, or similar).

What you will learn

• Depth with Organic and Advanced 2.5D/3D chiplet packaging.

• AI-based approach for fast iteration on different design ideas.

• SIPI-aware methodologies.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

*This position requires access to technology that requires a U.S. export license for persons whose most recent country of citizenship or permanent residence is a U.S. EAR Country Groups D:1, E1, or E2 country. *

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.