Job Summary:

The Manufacturing Engineering Director / Senior Director will lead the strategic direction and operational execution of all assembly and test engineering sustaining activities across our outsourced semiconductor assembly and test (OSAT) partner network. This role is critical to ensuring product quality, manufacturing yield optimization, process stability, and continuous improvement across multiple OSAT facilities in Asia. The successful candidate will serve as the primary technical interface between Semtech and our OSAT partners, driving manufacturing excellence while supporting new product introductions and legacy product sustaining, partnering with Engineering Leads from the Business Units and Quality Department.

Responsibilities:

OSAT Relationship & Performance Management

• Establish and maintain strategic technical relationships with executive and engineering leadership at key OSAT partners
• Drive OSAT performance through regular business reviews, KPI tracking, and accountability for quality, yield, delivery, and cost metrics
• Coordinate multi-site manufacturing strategies to optimize capacity utilization, cost, and risk mitigation
• Develop long-term manufacturing capacity and capability strategies aligned with business growth projections

Manufacturing Sustaining Engineering

• Drive manufacturing improvement initiatives and cost reduction programs while maintaining product quality and reliability
• Manage engineering change control processes (ECOs, PCNs) affecting manufacturing processes or materials
• Troubleshoot and resolve complex manufacturing issues including yield excursions, quality escapes, and process deviations

Quality & Reliability

• Partner with Quality organization to investigate and drive corrective actions for field returns, quality incidents, and customer complaints related to manufacturing
• Establish and monitor manufacturing quality metrics including DPPM, first pass yield, Cpk, and reliability test results

Technical Leadership & Team Development

• Build, mentor, and lead a team of sustaining engineers supporting OSAT operations
• Facilitate review of OSAT technical roadmap for assembly and test capabilities aligning with Business Units product roadmap requirements
• Provide technical guidance on packaging technology selection and manufacturing process best practices

Cross-Functional Collaboration

• Partner with Global Product Engineering team on design for manufacturability (DFM) and design for testability (DFT) requirements
• Collaborate with Supply Chain on capacity planning, material qualification, and supplier management
• Support New Product Introduction (NPI) teams with manufacturing process transfers and production ramps

Minimum Qualifications:

• Bachelor’s degree in electrical engineering, mechanical Engineering or related technical field.
• Minimum 12-15 years of experience in semiconductor manufacturing engineering with at least 5 years in leadership roles
• Deep technical expertise in semiconductor assembly processes and packaging technologies (wirebond, flip chip, advanced packaging)
• Strong understanding of semiconductor test engineering
• Proven track record managing and driving performance improvements across external manufacturing partners
• Experience with high-volume semiconductor manufacturing, yield analysis, and statistical process control

Desired Qualifications

• Knowledge of advanced packaging technologies such as 2.5D/3D integration, fan-out wafer level packaging (FOWLP), or system-in-package (SiP)
• Experience with multiple test platforms (e.g., Advantest V93000, Teradyne UltraFLEX)
• Cultural fluency working with Asia-based manufacturing partners
• knowledge an advantage
• Ability to travel internationally up to 25-30% to OSAT facilities in Asia and other regions