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トレンド企業

トレンド企業

採用

求人

SAIC

SAIC

SAIC

Technology integrator for government

Manufacturing Systems

Automotive Engineering

Supply Chain Management

Quality Control

Industrial IoT

Anting, Shanghai

10,001+

1955年設立(71年目)

オンサイト

Public

企業価値

$15B

SAIC

$95.38

売上高 (2026)

$0

営業利益

$0

募集中のポジション

0件のポジション

現在募集中のポジションはありません

製品・サービス

SY

Systems Engineering and Integration

Engineering Services

MG Brand Vehicles

MG Brand Vehicles

Automotive

Roewe Brand Vehicles

Roewe Brand Vehicles

Automotive

CY

Cybersecurity Solutions

Cybersecurity

Maxus Commercial Vehicles

Maxus Commercial Vehicles

Automotive

CL

Cloud Computing Services

Cloud Services

R Auto Electric Vehicles

R Auto Electric Vehicles

Electric Vehicles

DA

Data Analytics and AI

Analytics & AI

IM Motors

IM Motors

Electric Vehicles

DI

Digital Transformation

Digital Services

DE

Defense and Intelligence Solutions

Defense

SAIC Volkswagen Joint Venture

SAIC Volkswagen Joint Venture

Automotive

SAIC General Motors Joint Venture

SAIC General Motors Joint Venture

Automotive

HE

Healthcare IT Solutions

Healthcare IT

Automotive Finance Services

Automotive Finance Services

Financial Services

EN

Enterprise IT Services

IT Services

Mobility Services Platform

Mobility Services Platform

Digital Services

SO

Software Development

Software Development

PR

Program Management

Project Management

Auto Parts and Components

Auto Parts and Components

Manufacturing

経営陣

JRB

John Robert Beyster

Founder

JRB

John Robert Beyster

Founder

総閲覧数

0

応募クリック数

0

模擬応募者数

0

スクラップ

0

レビュー

3.9

10件のレビュー

ワークライフバランス

4.2

報酬

2.8

企業文化

4.1

キャリア

3.2

経営陣

3.0

72%

友人に勧める

良い点

Good work-life balance and flexible hours

Supportive and collaborative colleagues

Comprehensive benefits and retirement plans

改善点

Below market compensation and pay

Limited career advancement opportunities

Management lacks clear direction

給与レンジ

60件のデータ

Junior/L3

Junior/L3

1件のレポート

$85,111

年収総額

基本給

$73,965

ストック

-

$85,111

$85,111

面接体験

2件の面接

難易度

3.0

/ 5

期間

2-5w

面接プロセス

1

Application Review

2

HR Screen

3

Hiring Manager Interview

4

Technical Assessment

5

Panel Interview

6

Offer

連絡先・所在地