招聘

Senior Director, Systems Technology Development
San Diego, California, United States of America
·
On-site
·
Full-time
·
2mo ago
Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
We are seeking a Senior Director of Systems Technology Development to provide technical and execution leadership across our semiconductor technology portfolio. This role is designed for a highly experienced industry leader with deep hands‑on expertise in semiconductor technology development and a proven ability to deliver advanced silicon solutions into high‑volume products.
The ideal candidate brings strong execution focus across process, chiplets, heterogeneous integration including memory, and interconnect technologies, with the ability to evaluate and drive power, performance, area, and cost (PPAC) tradeoffs. This role will guide technology decisions that enable differentiated products across mobile, IoT, data center, automotive, and XR business units, particularly as the industry moves beyond traditional Moore’s Law scaling.
Position requires to be onsite in San Diego, 5 days a week
Key Responsibilities
Technology Execution & Integration Leadership
- Lead the execution of advanced semiconductor technologies from concept through manufacturing readiness.
- Drive technology integration across logic, memory, interconnect, and chiplets with a focus on robust, manufacturable solutions.
- Translate high‑level product and architectural requirements into clear technology requirements and implementation plans.
PPAC Optimization & Tradeoff Analysis
- Own and influence PPAC tradeoff decisions across process nodes, design choices, and chiplet approaches.
- Evaluate competing technology options to balance performance targets, power efficiency, die area, yield, and cost.
- Guide teams in making data‑driven decisions that optimize end‑product KPIs while maintaining schedule and risk discipline.
Cross-Functional Technical Leadership
- Interface closely with silicon design, process integration, packaging, product engineering, and manufacturing teams.
- Collaborate with internal domain experts to ensure cohesive execution across technology boundaries.
- Provide technical leadership and mentorship to senior engineers and technology leads across the organization.
Technology Roadmaps & Industry Engagement
- Influence medium‑ and long‑term technology roadmaps aligned with business and product needs.
- Help evolve the organization from a transistor‑scaling‑centric mindset toward technology and integration‑driven differentiation, including advanced packaging and heterogeneous integration.
- Engage with foundries, and key technology suppliers to assess readiness, risk, and scalability of emerging technologies.
Executive & Stakeholder Communication
- Clearly communicate technology risks, tradeoffs, and execution plans to executive stakeholders.
- Serve as a trusted technical advisor to leadership on technology investment decisions.
- Represent the company in senior‑level discussions with external partners and ecosystem leaders.
Ideal candidate will have
- 20+ years of experience in semiconductor technology development, process integration, or advanced silicon platforms.
- Deep expertise in logic process technologies, memory integration, interconnect, and chiplet heterogeneous integration.
- Strong track record of executing complex technologies into production.
- Demonstrated experience making and defending PPAC tradeoff decisions.
- Proven ability to lead and influence large, cross‑functional engineering teams.
- Experience working directly with foundries, and other semiconductor suppliers.
Preferred Qualifications
- Industry recognition as a senior technical leader in semiconductor technology execution or integration.
- Experience supporting multiple market segments (mobile, IoT, data center, automotive, XR).
- Background in 2.5D/3D, chiplets, heterogeneous integration.
- Strong understanding of manufacturing constraints, yield learning, and cost scaling.
Impact
In this role, you will directly shape the execution and integration of next‑generation semiconductor technologies, ensuring optimal PPAC outcomes at System level. Your leadership will enable high‑impact products across diverse business units while positioning the organization for sustained innovation beyond traditional scaling approaches.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience. OR
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$249,900.00 - $374,900.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
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关于Qualcomm

Qualcomm
PublicInventing the technologies the world loves.
10,001+
员工数
San Diego
总部位置
$136B
企业估值
评价
3.7
10条评价
工作生活平衡
2.8
薪酬
3.5
企业文化
3.2
职业发展
4.0
管理层
2.5
65%
推荐给朋友
优点
Good benefits and compensation
Great working atmosphere and colleagues
Challenging and interesting projects
缺点
Poor work-life balance
Toxic culture and leadership issues
Increasing pressure and micromanagement
薪资范围
21个数据点
Junior/L3
Junior/L3 · Data Scientist
0份报告
$196,000
年薪总额
基本工资
$150,000
股票
$33,000
奖金
$13,000
$166,600
$225,400
面试经验
9次面试
难度
2.6
/ 5
时长
14-28周
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
常见问题
Coding/Algorithm
Technical Knowledge
System Design
Behavioral/STAR
Past Experience
新闻动态
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