Senior Assembly & Packaging Engineer (HVM)

Company:

Qualcomm Korea YH:

Job Area:

Engineering Group, Engineering Group > Manufacturing Engineering

General Summary:

We are seeking an experienced substrate manufacturing engineer with a strong focus on High Volume Manufacturing (HVM) to support both RF front-end (RFFE) and digital products.
This role will work closely with development and cross-functional teams to ensure manufacturing readiness, stable mass production, KPI excellence, and continuous improvement across a diverse and growing product portfolio.

The successful candidate will directly manage products including automotive, RFFE, SiP modules, mobile, HPC, XR (AR/VR), and future chiplet-based solutions. Mainly focusing on substrate technologies/HVM management and approximately 20% of the role will involve broader assembly/package-level engagement as the organization expands.
The role also acts as a primary substrate focal point in OSAT‑facing forums, ensuring clear decision making, risk alignment, and execution from NPI to HVM.

Key ResponsibilitiesHVM & Manufacturing Ownership

• Own HVM readiness and execution for substrate‑based assembly products supporting both RF and digital applications
• Lead mass production ramp, stabilization, and lifecycle management across multiple product lines
• Monitor and manage manufacturing KPIs (yield, scrap, DPPM, cycle time, cost, reliability) and drive systematic improvements
• Own and review substrate‑specific HVM KPIs and trends through Substrate OSATs(e.g., SEMCO, LGIT) MOR and internal performance reviews, ensuring early identification and closure of yield, OTD, and reliability risks

Cross Functional Collaboration

• Work closely with package design, R&D, product engineering, quality, supply chain, and OSAT partners during NPI → HVM transition
• Provide manufacturing feedback to development teams to ensure design‑for‑manufacturability (DFM) and design‑for‑test (DFT) readiness
• Collaborate with cross‑functional teams from early NPI stages, leveraging substrate NPI performance data and support new material and process qualification, drive early risk identification, and ensure smooth transition from NPI to HVM

Excursion & Quality Management

• Lead manufacturing excursion management, including root cause analysis, containment, corrective and preventive actions (8D, RCA)

• Ensure production meets RFFE, automotive, consumer, and HPC quality and reliability requirements

• Provide technical leadership for substrate‑related quality and reliability issues surfaced during NPI and HVM, including FA direction and risk assessment for HVM carry‑over

• Support substrate material or process changes through PCN/TRB reviews, qualification planning, and controlled execution into HVM

Continuous Improvement

• Drive Continuous Improvement Programs (CIP) to enhance yield, productivity, cost, and robustness
• Identify opportunities for process optimization, material improvements, and supplier capability enhancement
• Proactively assess manufacturing and material risks (lead time, capacity, sourcing) and define mitigation or qualification strategies to protect HVM quality and delivery.

Future Technology & Packaging Involvement

• Support evolving technologies such as SiP, advanced RF modules, heterogeneous integration, and future HPCs
• Participate in broader assembly and packaging technology initiatives (approximately 20% of responsibility), aligned with long‑term roadmap development

Required Qualifications

• 6–15 years of experience (target ~10 years) in substrate with strong HVM ownership (assembly & packaging engineering experience is plus)

• Hands‑on experience with substrate‑based assembly supporting both RF front‑end and digital products

• Solid understanding of mass production KPI management, yield improvement, and manufacturing stability

• Direct experience in cross‑functional and cross‑site collaboration, including OSAT management

• Proven ability to manage manufacturing excursions and lead structured problem‑solving

• Engineering tools (FMEA/DOE/Trouble shooting)

• Quality tools and reports (SPC/PCN/8D/CAR)

• JEDEC, IPC and other industry specifications

• Strong communication skills in a global, matrixed organization

• Permitted to work in South Korea and need to travel within Asia or US on occasion

Preferred Qualifications

• Experience supporting automotive‑grade products, SiP modules, or advanced RF packaging
• Exposure to HPC, mobile, XR (AR/VR), or chiplet / heterogeneous integration technologies
• Familiarity with advanced substrate processes (and assembly)
• Experience driving long‑term manufacturing excellence and cost optimization initiatives
• Experience owning supplier‑facing technical engagements such as substrate PCN reviews, qualification alignment, and TRB‑level discussions
• Self-motivated project management and good communication skills both in English/Korean

Why Join Us

• Opportunity to work across cutting‑edge RF, digital, and advanced packaging technologies
• Broad product exposure from automotive to HPC and next‑generation XR platforms
• Significant ownership in shaping HVM strategy and future packaging directions
• Collaborative environment with strong influence across development and manufacturing organizations

Minimum Qualifications:

• Bachelor's degree in Engineering, Physical Sciences, or related field and 6+ years of Manufacturing Engineering or related work experience.
  OR
  Master's degree in Engineering, Physical Sciences, or related field and 5+ years of Manufacturing Engineering or related work experience.
  OR
  PhD in Engineering, Physical Sciences, or related field and 4+ years of Manufacturing Engineering or related work experience.

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