Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

The IC Package Architecture and Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR
  Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
  OR
  PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Role and Responsibilities:

• Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, and selection.
• Own and drive advanced package selection, new generation product package structure, and configuration optimization.
• Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
• Work with multi-functional teams to achieve optimized mechanical, electrical SI/PI, and thermal performance for various types of chips.
• Work with IC PD team on top level floor planning including hard macro block placement, paring, RDL and bump pattern/assignment
• Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
• Explore, evaluate, and develop new CAD tools, design, and verification flow.
• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

Preferred Qualifications

• Basic knowledge in high-speed IO interfaces and electromagnetic field.
• Knowledge of IC packaging structures and package-board interaction.
• Basic knowledge of electronic packaging process and typical failure modes preferred.
• Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
• Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
• Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
• Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
• Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
• Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
• Experience with Calibre tool and package design reviews.
• Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
• Solid understanding of Design Rules Check and Design for Manufacturing.
• Experience with 2.5D Si-Bridge design in Virtuoso or similar CAD tools is a plus.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$154,000.00 - $231,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.