Jobs
Company:
Qualcomm Semiconductor Limited:
Job Area:
Engineering Group, Engineering Group > Mechanical Engineering
General Summary:
Job Overview
The candidate will be working directly for Qualcomm as a Sr mechanical engineer developing PCB-based electromechanical assembly designs across test and form factor accurate Server & rack level reference designs.
Responsibilities include:
- New AI Cloud Server rack level realistic driven designs for Internal test teams as well as customer driven server needs.
- Creating and releasing 3D CAD designs and documentation
- Electromechanical layout & enclosure design of test platforms, including rack level layouts.
- Creating, sourcing, and sustaining mechanical assembly bill-of-materials.
- Coordinating/sourcing prototype plastic, sheet metal, CNC machined mechanical assembly components including housings / frames, heatsinks, antennas, mounts, chassis, etc.
- Coordinating with suppliers, sourcing, and manufacturing staff to facilitate initial prototype and production builds.
- Communicate and collaborate effectively with multi-disciplinary team members in various geographical regions.
- Develop basic thermal & structural analysis models of mechanical assemblies.
- Effectively communicate and collaborate with multi-disciplinary teams across various geographical regions.
- Full time 5days / week onsite presence needed.
Engineer will interface with internal staff and outside suppliers in the fast-paced execution of a wide variety of multi-disciplined design projects.
Minimum Qualifications
- BSME or equiv from accredited college
Preferred Qualifications
- Strong understanding of mechanical engineering product design fundamentals
- 3+ years exp working on Server rack level products.
- 3+ 3D solid modelling design tools experience utilizing CREO, Solid works or equivalent platform.
- 3+ year design experience with plastic injection molded, die cast, formed sheet metal, and machined parts.
- 3+ year experience working on mechanical constraints for printed circuit boards designed in a packaged rack / test platform.
- 3+ years exp with HDI layout designs for manufacture.
- 3+ years exp with high speed cabling designs
- 1+ years experience using 3D thermal analysis software like Flowtherm or Icepak.
- 1+ years experience with structural analysis FEA tools.
- Stack up tolerance analysis of complex design systems.
- Basic understanding of antenna design, RF, thermal and industrial design constraint requirements for server / rack form-factor designs.
- Strong written and verbal communication skills.
Additional Skills
- Top-down solid modelling experience with 3D design databases.
- Design constraint (EMN file) transfer experience between 3D CAD and PCB electronic CAD designs.
- Test/assembly fixture design experience
- Experience with PDM systems (Agile preferred) for BOM and project management.
Education Requirements
BSME (Bachelors – Mechanical Engineering) required;
Minimum Qualifications:
- Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience. OR
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
OR
PhD in Mechanical Engineering or related field.
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
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About Qualcomm

Qualcomm
PublicInventing the technologies the world loves.
10,001+
Employees
San Diego
Headquarters
Reviews
3.6
5 reviews
Work Life Balance
4.0
Compensation
4.0
Culture
2.5
Career
3.0
Management
2.5
Pros
Good work-life balance
Real engineering work with technical challenges
Good compensation
Cons
Slow processes and bureaucracy
Poor management and planning
Cross-team dependencies and alignment issues
Salary Ranges
1 data points
Junior/L3
Junior/L3 · Data Scientist
0 reports
$215,000
total / year
Base
$170,000
Stock
$30,000
Bonus
$15,000
$182,750
$247,250
Interview Experience
8 interviews
Difficulty
3.4
/ 5
Duration
14-28 weeks
Experience
Positive 0%
Neutral 50%
Negative 50%
Interview Process
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Technical Interview/Onsite
5
Team Matching
6
Offer
Common Questions
Coding/Algorithm
Technical Knowledge
System Design
Behavioral/STAR
Past Experience
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