Company:

Qualcomm Semiconductor Limited:

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

Qualcomm's central baseband hardware systems organization designs baseband and embedded system reference designs with a focus on co-design of the silicon, package, and PCB interconnect for Qualcomm’s application processor and power management ASICS. These highly integrated reference designs incorporate Qualcomm’s high performance SOCs, high speed memories, high resolution displays, power management ICs (PMICs), 5G RF transceiver cards and a host of digital & analog peripherals (audio, USB/OTG, Bluetooth, GPS, MIPI, WLAN and LAN/Ethernet).

Job responsibilities include working across disciplines and geo diverse teams to define the external facing reference design requirements, working with the hardware team to define the architecture of the platform, designing and documenting the reference platform, schematic and BOM capture, working with the CAD team on the PWB layout, signal and power integrity analysis, direct engagement and design leadership with strategic ODMs for internal reference design production, close collaboration with internal customer engineering team to support ODM design activities, and documentation of design and layout guidance which can be utilized by internal and external teams.

Successful applicants to this position will design AR glasses, VR headsets, wearables, Laptops, tablets, and compute specific baseband reference designs utilizing Qualcomm So Cs, ASICs and power management ICs. These reference designs are comprised of a primary SoC(s) along with multiple digital/baseband, analog and 5G RF modules with interfaces operating at gigabit speeds and require a working knowledge of applicable high-speed design practices along with familiarity of typical AR/VR hardware, wearables, laptop, tablet, and computer design strategies. Applicants will need to assimilate quickly onto an existing project, read/write technical specifications/requirements, develop/refine hardware designs (signal/power integrity, PWB layout & stackup, schematic entry), work closely/communicate with geo diverse design teams, demonstrate strong problem solving abilities, partner with silicon design and package engineers, collaborate closely with internal customer engineering team to support ODM designs, and actively contribute toward the co-design of an application processor SoC. Applicants will need strong communication skills and will be required to work with engineers both internally and externally including completing design reviews and feedback on ODM manufactured reference designs.

Design responsibilities include: high-speed digital/baseband design of multi-layer PWBs, electrical and mechanical integration into a consumer industrial design, signal integrity analysis and simulation of LPDDR5+ memories and gigabit transceivers, familiarity of power supply design/topologies, standardize high speed serial interfaces (PCIe, USB, Ethernet, SPI, I2C, etc.), and design techniques for high volume manufacturing

Academic or Professional use of the following skills is required:

• Board level experience designing CPU-based circuit cards, consumer electronics, AR/VR devices, wearables, compute devices, and/or low power platforms

• Digital/baseband & analog circuit experience

• Signal and power integrity analysis tools and techniques

• Communicating with international teams in English (spoken and written)

The following skills are highly desired:

• Experience with Smart Glasses, AR Glasses, VR Headsets, or other wearable hardware design

• Experience with laptop, tablet, and computer hardware design

• Experience working with 1GHz+ ARM or x86 hardware platforms that include LPDDRx memory interfaces.

• Experience with multi-module, high speed designs and DFT/DFM.

• Experience with low-power design techniques

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR
  Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
  OR
  PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

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