招聘

Director, Product Management - Automotive Software (3P OSV Partnerships & Safety OS)
San Diego, California, United States of America
·
On-site
·
Full-time
·
3mo ago
必备技能
Linux
Company:
Qualcomm Technologies, Inc.
Job Area:
Operations Group, Operations Group > Product Management
General Summary:
Key Responsibilities
- Own the consolidated roadmap for OS offerings; align with Automotive architecture, platform constraints, and long‑term SDV objectives.
- Define and manage the OSV engagement model (delivery planning, milestones, governance); drive on‑time artifacts and integration quality.
- Govern the integration lifecycle across BSP, platform services, and virtualization/hypervisor layers to ensure repeatable, production‑grade patterns.
- Drive and shape upstream directions for platform components—kernel, build systems, packaging, LTS strategy—to enhance modularity, maintainability, and release cadence.
- Serve as the primary escalation point for OSV‑related technical or delivery issues; drive crisp decision logs, risk burn‑down, and stakeholder comms.
- Establish data‑driven KPIs (stability, readiness, performance, certification progress) and publish executive scorecards.
Minimum Qualifications:
- Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or related field.
- 8+ years of Product Management or related work experience.
Preferred Qualifications:
- 12+ years in Product Management or Technical Product Ownership for OS/platforms or embedded systems, including externally facing delivery.
- Proven leadership across multi‑stakeholder ecosystems (internal eng, program mgmt, quality, external OS vendors) with roadmap and release accountability.
- Track record of taking platform features from PRD → plan → production across diverse So Cs and program constraints.
- Open source ecosystems: Deep, hands‑on familiarity with Linux,Yocto Project,AGL,Zephyr, and related upstream workflows (e.g., layer management, meta‑layers, patches, LTS/long‑tail maintenance, SPDX/OSS compliance basics), including contribution and upstreaming strategies.
- Platform integration: Experience leading OS bring‑up, BSP integration, partitioning, and virtualization/hypervisor alignment on automotive‑class hardware.
- Safety & standards: Working knowledge of ISO 26262/functional safety deliverables and how they intersect with OS and BSP integration.
- Exposure to Automotive SPICE workflows and phase‑gate evidence sufficient to partner effectively with Quality/Program teams.
- Execution & leadership: Executive‑level communication, partner negotiation, and escalation management; metric‑driven decision‑making and POR discipline.
This is an office based position located in San Diego, CA and is expected to comply with the company's onsite work policy.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$196,000.00 - $294,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
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关于Qualcomm

Qualcomm
PublicInventing the technologies the world loves.
10,001+
员工数
San Diego
总部位置
$136B
企业估值
评价
3.7
10条评价
工作生活平衡
2.8
薪酬
3.5
企业文化
3.2
职业发展
3.8
管理层
2.5
65%
推荐给朋友
优点
Good benefits and compensation
Challenging and interesting work
Great team and colleagues
缺点
Management and leadership issues
Work-life balance concerns
Toxic culture/micromanagement
薪资范围
21个数据点
Junior/L3
Senior/L5
Staff/L6
VP
Director
Junior/L3 · Product Manager
0份报告
$176,900
年薪总额
基本工资
-
股票
-
奖金
-
$150,365
$203,435
面试经验
9次面试
难度
2.6
/ 5
时长
14-28周
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
常见问题
Coding/Algorithm
Technical Knowledge
System Design
Behavioral/STAR
Past Experience
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