Job Description:
This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

• New packaging technology development
• New package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)

Qualification:

• Pursuing in master degree
• Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
• At least CET-4 degree or equivalent English level and CET-6 is preferred.
• Intention and capability to work in a cross-functional/global team environment.
• Independent R&D capability.

More information about NXP in Greater China...