• Responsible for supporting backend process and improvement on assigned packages
• Responsible for quality, yield, cost and process improvement activities.
• Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc.
• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
• Take ownership to work closely with peers and management to drive assigned deliverables

Requirements:

• Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).

• 1-2 years of work experience with semiconductor assembly background for automotive customers (Fresh grads are encouraged to apply)

• Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.

• Passionate in continuous learning and drive for improvement

• Good SPC, Process Control and other relevant statistical & problem-solving skills

• Good in Microsoft application (PowerPoint, Excel Macro, Word, Auto CAD, etc.).

• Project management knowledge is an added advantage.

More information about NXP in Malaysia...