Ready to join the future of innovation in SoC Architecture?

This opening is within the Advanced Chip Engineering (ACE) SoC Organization, a central R&D Design group responsible for end-to-end IC/SoC implementation of the Automotive and Industrial Automation Processors in NXP.

We are seeking an IC SoC Product & Subsystem Architect to join our team in Hamburg, Germany. The Hamburg SoC integration team develops complete “System on Chip” products in the domain of Radar applications and Radio Infotainment.

International relocation can be accommodated for qualified candidates.

Our team

As part of the Microprocessor SoC Implementation ACE R&D team in NXP, the product development of a large significant portion of NXP roadmap comes out of this organization and, consequently, there is remarkable visibility to the Corporate NXP Management team.

The candidate would be integrated in a team based in Hamburg, Germany and with day-to-day interactions with other design teams based locally or abroad. Our team has a track record of more than 20 years of successful product designs and innovation.

Your Responsibilities:

• Architecture and spec definition of subsystem/IP components and/or top-level IC SoC products, split into hardware building blocks, requirements and interfaces

• Development of digital signal processing algorithms and hardware IP design in Verilog / VHDL

• Area / power estimation and optimization

• Support of FPGA, Verification (pre-silicon) and Validation (post-silicon) activities

• Technical lead for a team of hardware developers during product development, including resolution of most complex problems.

• RTL design, implementation and integration of different IPs and subsystems

• Quality checks using EDA tools

• Usage and creation of IA/ML Agents that improve our flows, efficiency and methodologies

• Research and feasibility studies to determine product roadmaps and technical ways forward

• Support in innovation projects and test chip development

• Close collaboration with Verification, Design, DFT and Physical design teams across the world

Your profile

• Strong team leadership skills desirable to be able to lead a technical team

• Advanced knowledge of digital circuit design incl. FPGA design and verification

• Basic RFCMOS circuit design knowledge

• In-depth digital signal processing know-how

• Basic knowledge of embedded compute cores like Arm Cortex family

• Basic knowledge of digital signal and vector processor cores

• Hands-on experience in requirements engineering and related tools

• In-depth knowledge of the semiconductor industry and technologies

• At least basic knowledge of automotive safety related procedures

• Further growth into system-on-chip architect role desired

• Proven experience with automation using several programming and scripting languages

• Fluent written and verbal communication in English

Key Soft Skills

• Team player capable to work in multi-national teams demonstrating strong engagement and contribution

• Proficient skills in both written and verbal communication. Can articulate well

• Can demonstrate emotional intelligence and ability to work well as a part of local and international teams

Education & seniority

• Master of Science in Electrical or Electronics Engineering

• At least 5-10 years of industry experience

• 2+ years of experience in hardware architecture design for system-on-chip / embedded systems

Please note: The successful candidate may/will be responsible for security related tasks. The assignment may/will be in scope of security certifications, therefore a conscious and reliable way of working is necessary

More information about NXP in Germany...