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职位NXP Semiconductors

2026 Intern - Embedded Software Development Engineer - UWB RADAR

NXP Semiconductors

2026 Intern - Embedded Software Development Engineer - UWB RADAR

NXP Semiconductors

Shanghai (JingAn)

·

On-site

·

Internship

·

1w ago

Responsibilities:

  • UWB radar application investigation for CPD, Kicking Sensor, Parking Assistance...

  • Work with team to conduct measurement and algorithm development with DSP toolbox and machine learning

  • Signal processing and relevant algorithm implementing and verification

Requirements:

  • Bachelor’s or Master’s degree in Electronics, Electrical Engineering, or a related field, with a strong foundation in Electronic Information Engineering.

  • Proficient in programming languages including C/C++, Python, and MATLAB, with hands-on experience in algorithm development and system simulation.

  • Solid understanding of signal processing and communication systems, including modulation techniques, channel coding, and system-level design.

  • Strong communication and presentation skills, capable of conveying technical concepts clearly to both technical and non-technical audiences.

  • Highly self-motivated, with a proven ability to work effectively both independently and as part of a collaborative team

More information about NXP in Greater China...

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关于NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

员工数

Eindhoven

总部位置

$45B

企业估值

评价

3.7

10条评价

工作生活平衡

3.5

薪酬

4.0

企业文化

3.8

职业发展

3.2

管理层

3.0

72%

推荐给朋友

优点

Supportive management and colleagues

Innovation and interesting technology

Good work-life balance and flexible hours

缺点

Management issues and poor communication

Limited career advancement and training

Heavy workload and long hours

薪资范围

227个数据点

Junior/L3

L3

Intern

Junior/L3 · Data Scientist

0份报告

$114,000

年薪总额

基本工资

$99,000

股票

-

奖金

$15,000

$96,900

$131,100

面试经验

42次面试

难度

3.1

/ 5

时长

14-28周

录用率

33%

体验

正面 69%

中性 13%

负面 18%

面试流程

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

常见问题

Technical skills

Past experience

Team collaboration

Problem solving