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NXP Semiconductors
NXP Semiconductors

Leading company in the semiconductor industry

System IC Architect - Advanced Power Systems

职能前端
级别Staff+
地点Chandler (Office)
方式现场办公
类型全职
发布3个月前
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Advanced Power Systems (APS) - System IC Architect

Department

Advanced Power Systems (APS)

Role Overview

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration. We're looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements.

Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Key Responsibilities

Product Definition & Strategy

  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
  • Translate customer requirements into innovative packaging and power management solutions.
  • Support development through thermal optimization and electrical analysis.

System-Level Integration

  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems. Expertise in System-in-Package (SiP) integration is essential.
  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.

Thermal Management & Advisory

  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability.

Cross-Functional Leadership

  • Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs.
  • Act as a technical liaison with customers, supporting co-development and design-in activities.

Technical Advisory & Reporting

  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness.
  • Report KPIs and project status to executive stakeholders.

Preferred Qualifications

Education & Experience

  • Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred)
  • 15+ years of experience in power semiconductors, packaging, and system-level integration. Expertise in System-in-Package (SiP) integration is essential.
  • Proven track record in product definition through revenue realization

Technical Expertise

  • Strong expertise in thermal management, electrical performance, and advanced reliability
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508)

Leadership & Interpersonal Skills

  • Demonstrated ability to lead cross-functional, global teams and manage complex projects
  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams
  • Creative mindset with strong problem-solving capabilities
  • Willingness to travel globally

Location

This position can be done from anywhere in the United States and is open to 100% remote, however some travel to our Chandler site where the team sits will be required each quarter in addition to any necessary customer visits.

About NXP

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com

Equal Opportunity & Commitment

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.

Application Information

Job ID: #

If you are already an NXP employee, do not apply here. Instead, you must apply via our internal career page.

Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise.

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关于NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

员工数

Eindhoven

总部位置

$45B

企业估值

评价

10条评价

3.7

10条评价

工作生活平衡

3.5

薪酬

4.0

企业文化

3.8

职业发展

3.2

管理层

3.0

72%

推荐率

优点

Supportive management and colleagues

Innovation and interesting technology

Good work-life balance and flexible hours

缺点

Management issues and poor communication

Limited career advancement and training

Heavy workload and long hours

薪资范围

227个数据点

Junior/L3

Intern

L3

Junior/L3 · Data Scientist

0份报告

$114,000

年薪总额

基本工资

$99,000

股票

-

奖金

$15,000

$96,900

$131,100

面试评价

42条评价

难度

3.1

/ 5

时长

14-28周

录用率

33%

体验

正面 69%

中性 13%

负面 18%

面试流程

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

常见问题

Technical skills

Past experience

Team collaboration

Problem solving