Leading company in the semiconductor industry
Test BackEnd (Pack) Process Manager
1. This role leads process engineering team ( 6 engineers + 8 DL), and work closely with manufacturing, equipment, quality.
2. Lead process optimization, improve yield, re-scan rate reduction as part of scanner OEE improvement, LOH generation reduction.
3. Vision SME, Drive visual mechanical improvement, drive automated vision coverage per outgoing, and work on manual inspection elimination.
4. Collaborate with equipment and vendor for vision enhancement, covering from 0.5mils crack & OCR implementation.
5. Lead low tech quality improvement, process simplification, poka yoke detection as last gate of operation before customer.
6. Ensure compliance with SOP, customer, and industry standard. Drive zero non-compliance issue during internal GMA audits, IAFT audits and various customer audits.
7. One of key leads for STM's various projects including label, packing methods, knowledge transfer in order to meet ST requirement and ensure smoonth transition.
8. Support NPI and transferred devices qual, ensure resources alignment betwn NPI and operational improvement task.
9. One of the important key stakeholder in automation implementation, derive risk during process mapping and FMEA, collaborate with automation team with vendor strategy, IT requirement.
10. Lead & mentor process engineering team, set KPIs and drive team performance.
Qualifications
- BSc or greater in Mechanical, E&E, Mechatronics, Electrical Engineering, Mechanical, Chemical Engineering or related subject.
- Minimum 5 years working in semiconductor manufacturing, preferably relatable in process engineering.
- Posses vision system, relatable automation technical knowledge.
- Be very structured and methodical on developing and meeting plans and schedules, Green belt / Black Belt preferred.
- Have strong knowledge and experience in project management, continuous improvement, process optimization.
- Skills in Quality tools including FMEA/CP/SPC, and able to lead audits (both customer and 3rd party audits)
- High capacity to effectively handle multiple tasks with varying levels of complexity.
- Ability to articulate the complex requirements into simple tasks and roadmaps with ability of prioritization.
- Able to drive and set right expectation. Celebrate for wins, and hold right accountability.
Behaviors
- Ownership, have right mindset and behavior, willing to go extra-mile to win
- Speed of execution and strike for results.
- Cultivates Innovation, generates creative ideas and solutions, adapts quickly to new trends and technologies.
- Collaborates, actively works with others to achieve shared goals, builds trust and resolve conflicts constructively.
- Unstoppable, resilient, and nimble learning (Demonstrates curiosity and continuous improvement mindset)
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关于NXP Semiconductors
NXP Semiconductors
PublicNXP Semiconductors produces secure connectivity solutions for embedded applications.
10,001+
员工数
Eindhoven
总部位置
$45B
企业估值
评价
10条评价
3.7
10条评价
工作生活平衡
3.5
薪酬
4.0
企业文化
3.8
职业发展
3.2
管理层
3.0
72%
推荐率
优点
Supportive management and colleagues
Innovation and interesting technology
Good work-life balance and flexible hours
缺点
Management issues and poor communication
Limited career advancement and training
Heavy workload and long hours
薪资范围
227个数据点
Junior/L3
Intern
L3
Junior/L3 · Data Scientist
0份报告
$114,000
年薪总额
基本工资
$99,000
股票
-
奖金
$15,000
$96,900
$131,100
面试评价
42条评价
难度
3.1
/ 5
时长
14-28周
录用率
33%
体验
正面 69%
中性 13%
负面 18%
面试流程
1
Phone Screen
2
Technical Interview
3
Hiring Manager
4
Team Fit
常见问题
Technical skills
Past experience
Team collaboration
Problem solving
最新动态
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Wolfe Research raises NXP Semiconductors stock price target to $320 - Investing.com
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Evercore ISI raises NXP Semiconductors price target on strong outlook - Investing.com
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