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NXP Semiconductors
NXP Semiconductors

Leading company in the semiconductor industry

Diffusion Equipment Engineer

职能工程
级别中级
地点Chandler (Office)
方式现场办公
类型全职
发布1个月前
立即申请

Job Title:

Diffusion Equipment Engineer:

Business Line Description:Front End Operations plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a winning advantage for our customers.

Job Summary:The Diffusion Equipment Engineer opportunity is in a high-volume semiconductor wafer manufacturing environment. Prior experience with ownership and responsibility for the maintenance, troubleshooting, repair and productivity of manufacturing tools/processes is required. Previous experience with SVG VTR7000, AVP8000, TEL Alpha 8S and/or TEL Alpha 8SE Waves furnaces and Lumonics Laser Scribe is highly desirable.

Key Challenges

· Identification and reduction of recurrent machine faults

· Sourcing and installing new equipment

· Reducing defectivity

· Defining tool maintenance procedures

· Training technicians and peers

· Improving tool utilization and availability

· Reducing cost

· Reducing scrap

· Supporting development activities

· Developing and writing specifications

· Implementation of Six-Sigma statistical process control methods

· Capacity planning and modeling

· Participating in and/or leading cross-functional and lean activity teams

Job Qualifications:

· BS in an engineering discipline.

· 5 years’ experience in equipment engineering in a high-volume semiconductor manufacturing environment.

· Previous experience in at least one or more of the following tools/processes preferred: SVG VTR7000, AVP8000, TEL Alpha 8S and/or TEL Alpha 8SE Waves furnaces and Lumonics Laser Scribe.

· Working knowledge of associated furnace pumps and abatement system desrired.

· Ability to generate, analyze, and interpret equipment performance data and produce a timely action plan .to resolve recurring equipment failures.

· Demonstrated presentation skills. Candidates will be called upon to train others and present complex datasets and equipment problems/solutions to diverse audiences.

· Competent in troubleshooting problems and capable of applying logic to isolate and repair.

· Ability to deal with multiple issues and fluid priorities.

· Strong verbal and written communication skills.

· Ability to interact professionally with manufacturing and process engineering to deal with these issues and priorities.

· Good foundational problem-solving skills with creative solutions and out-of-the-box thinking.

· Self-motivated; able to take initiative and effectively prioritize work for self.

· A strong desire to help create a positive, winning, world class working environment.

· Previous experience in Lean Manufacturing methods is highly desirable.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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关于NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

员工数

Eindhoven

总部位置

$45B

企业估值

评价

10条评价

3.7

10条评价

工作生活平衡

3.5

薪酬

4.0

企业文化

3.8

职业发展

3.2

管理层

3.0

72%

推荐率

优点

Supportive management and colleagues

Innovation and interesting technology

Good work-life balance and flexible hours

缺点

Management issues and poor communication

Limited career advancement and training

Heavy workload and long hours

薪资范围

227个数据点

Junior/L3

Intern

L3

Junior/L3 · Data Scientist

0份报告

$114,000

年薪总额

基本工资

$99,000

股票

-

奖金

$15,000

$96,900

$131,100

面试评价

42条评价

难度

3.1

/ 5

时长

14-28周

录用率

33%

体验

正面 69%

中性 13%

负面 18%

面试流程

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

常见问题

Technical skills

Past experience

Team collaboration

Problem solving