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Wire Bond Process Manager

NXP Semiconductors

Wire Bond Process Manager

NXP Semiconductors

Kaohsiung

·

On-site

·

Full-time

·

2mo ago

Required skills

Process management

Manufacturing operations

Quality improvement

Leadership

  • Identify and set a consolidated implementation plan for gearing up new process, new material, new equipment to get best operation for mass production.
  • Improve the AFE process capability and stability to achieve the best quality and yield performance in the AFE manufacturing line.
  • Provide technology and operation training to instructors, technicians, and machine keepers in AFE processes of manufacturing lines to support smooth production.
  • Cooperate with Innovation / IMD / vendors / manufacturing lines to develop new packages and new processes, ensuring smooth production ramp-up and meeting budgeted yield requirements.
  • Implement and control the progress of Q/C/D‑related improvement projects.
  • Implement corrective actions for low yield and customer complaint issues related to Q/C/D, based on analysis with the Q&R department.
  • Train, coach, and motivate subordinates through various activities to support individual growth and enhance technical capability.
  • Refine AFE process flow to improve cycle time and cost.

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About NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

Employees

Eindhoven

Headquarters

$45B

Valuation

Reviews

3.7

10 reviews

Work-life balance

3.8

Compensation

4.0

Culture

4.2

Career

3.2

Management

3.0

72%

Recommend to a friend

Pros

Supportive management and colleagues

Good work-life balance and flexible hours

Innovation and interesting technology projects

Cons

Limited career advancement and training opportunities

Management communication and organization issues

Heavy workload and long hours during deadlines

Salary Ranges

227 data points

Junior/L3

L3

Intern

Junior/L3 · Data Scientist

0 reports

$114,000

total per year

Base

$99,000

Stock

-

Bonus

$15,000

$96,900

$131,100

Interview experience

42 interviews

Difficulty

3.1

/ 5

Duration

14-28 weeks

Offer rate

33%

Experience

Positive 69%

Neutral 13%

Negative 18%

Interview process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common questions

Technical skills

Past experience

Team collaboration

Problem solving