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Wire Bond Process Manager

NXP Semiconductors

Wire Bond Process Manager

NXP Semiconductors

Kaohsiung

·

On-site

·

Full-time

·

2w ago

Required Skills

Process management

Manufacturing operations

Quality improvement

Leadership

  • Identify and set a consolidated implementation plan for gearing up new process, new material, new equipment to get best operation for mass production.
  • Improve the AFE process capability and stability to achieve the best quality and yield performance in the AFE manufacturing line.
  • Provide technology and operation training to instructors, technicians, and machine keepers in AFE processes of manufacturing lines to support smooth production.
  • Cooperate with Innovation / IMD / vendors / manufacturing lines to develop new packages and new processes, ensuring smooth production ramp-up and meeting budgeted yield requirements.
  • Implement and control the progress of Q/C/D‑related improvement projects.
  • Implement corrective actions for low yield and customer complaint issues related to Q/C/D, based on analysis with the Q&R department.
  • Train, coach, and motivate subordinates through various activities to support individual growth and enhance technical capability.
  • Refine AFE process flow to improve cycle time and cost.

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About NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

Employees

Eindhoven

Headquarters

Reviews

3.9

44 reviews

Work Life Balance

3.8

Compensation

3.9

Culture

4.1

Career

3.6

Management

3.8

73%

Recommend to a Friend

Pros

Competitive compensation and benefits

Good work-life balance and flexible environment

Interesting projects and challenges

Cons

Room for improvement in processes

Work-life balance varies by team

Internal communication could improve

Salary Ranges

267 data points

Junior/L3

L3

Junior/L3 · Data Scientist

0 reports

$114,000

total / year

Base

$99,000

Stock

-

Bonus

$15,000

$96,900

$131,100

Interview Experience

42 interviews

Difficulty

3.1

/ 5

Duration

14-28 weeks

Offer Rate

33%

Experience

Positive 69%

Neutral 13%

Negative 18%

Interview Process

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

Common Questions

Technical skills

Past experience

Team collaboration

Problem solving