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职位NXP Semiconductors

Wire Bond Process Manager

NXP Semiconductors

Wire Bond Process Manager

NXP Semiconductors

Kaohsiung

·

On-site

·

Full-time

·

2mo ago

必备技能

Process management

Manufacturing operations

Quality improvement

Leadership

  • Identify and set a consolidated implementation plan for gearing up new process, new material, new equipment to get best operation for mass production.
  • Improve the AFE process capability and stability to achieve the best quality and yield performance in the AFE manufacturing line.
  • Provide technology and operation training to instructors, technicians, and machine keepers in AFE processes of manufacturing lines to support smooth production.
  • Cooperate with Innovation / IMD / vendors / manufacturing lines to develop new packages and new processes, ensuring smooth production ramp-up and meeting budgeted yield requirements.
  • Implement and control the progress of Q/C/D‑related improvement projects.
  • Implement corrective actions for low yield and customer complaint issues related to Q/C/D, based on analysis with the Q&R department.
  • Train, coach, and motivate subordinates through various activities to support individual growth and enhance technical capability.
  • Refine AFE process flow to improve cycle time and cost.

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关于NXP Semiconductors

NXP Semiconductors

NXP Semiconductors produces secure connectivity solutions for embedded applications.

10,001+

员工数

Eindhoven

总部位置

$45B

企业估值

评价

3.7

10条评价

工作生活平衡

3.8

薪酬

4.0

企业文化

4.2

职业发展

3.2

管理层

3.0

72%

推荐给朋友

优点

Supportive management and colleagues

Good work-life balance and flexible hours

Innovation and interesting technology projects

缺点

Limited career advancement and training opportunities

Management communication and organization issues

Heavy workload and long hours during deadlines

薪资范围

227个数据点

Junior/L3

L3

Intern

Junior/L3 · Data Scientist

0份报告

$114,000

年薪总额

基本工资

$99,000

股票

-

奖金

$15,000

$96,900

$131,100

面试经验

42次面试

难度

3.1

/ 5

时长

14-28周

录用率

33%

体验

正面 69%

中性 13%

负面 18%

面试流程

1

Phone Screen

2

Technical Interview

3

Hiring Manager

4

Team Fit

常见问题

Technical skills

Past experience

Team collaboration

Problem solving