【Why This Role?】

• Drive Core Technology:

Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness.

• Lead Mass Production Breakthroughs:

Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM).

• Cross-Domain Collaboration:

Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below).

【Key Responsibilities】

• Process Integration Leadership:

Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks.

• Deep Characterization & Analysis:

Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions.

• Yield Enhancement & Stability:

Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency.

• Foundry Management:

Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer.

【Required Qualifications】

• Education:

Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field.

• Experience:

10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (e Flash, RRAM, MRAM).

• Data Insight:

Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics.

【Preferred Skills】

• Process Transfer Expertise:

Successful track record in "Copy-Smart" process migration, ensuring process consistency and rapid yield ramp-up during technology transfer.

• BCD Process Expertise:

Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization.

• Advanced Node Experience:

Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond.

• Design Collaboration:

Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design.

【Soft Qualities】

• Analytical Thinking:

Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies.

• Proactive Ownership:

Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks.

• Effective Communication:

Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.

More information about NXP in Greater China...