We are seeking an experienced, analytical, and highly motivated engineer to lead CHIP and PCB NPI activities for Networking products. This role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. The ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. Success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. As part of NVIDIA’s Networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.

What you'll be doing:

• Lead CHIP/Substrate/OSAT/PCB qualification for Networking products (2nd source).

• Collaborate with engineering teams to identify suitable Substrate suppliers based on technical capability and capacity and define the qualification plan.

• Coordinate and lead changes through the ECR/CCB process.

• Work with engineering teams to create the product BOM and plan initial qualification activities on the ASSY floor.

• Track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.

• Develop and execute risk plans for material requirements prior to qualification completion.

• Identify critical paths and bottlenecks; implement risk management methodologies.

• Develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.

• Create and maintain systems for data management and task tracking using Power BI and other advanced systems, including AI-driven tools.

What we need to see:

• B.Sc. in Industrial engineering, Material or Chemical engineering or a related field, or equivalent experience.

• Strong engineering background with business and operations proficiency.

• 5+ years of proven experience in leading sophisticated, highly technology-intensive projects (Semiconductor– advantage).

• Strong critical thinking, attention to detail, and strong decision-making skills.

• Independent and proactive approach – being able to own a task but also to deep dive into the relevant details surrounding it.

• Performs well in an intensive environment

• Working hour flexibility (working with global parties).

• Ability to manage schedule and meet deadlines.

• Multitasking, good interpersonal skills and a great teammate.

• Proficient in English – reading, writing, and speaking.

• Microsoft Office tools

• Excellent skills in Word, Excel, and PowerPoint tools.