
Pioneering accelerated computing and AI
Principal Thermal Mechanical Photonic Designer
We are now looking for a Principal Thermal Mechanical Photonic Designer. We are part of the global circuits team at NVIDIA that craft the state-of-the-art GPUs for all applications such as supercomputers, gaming consoles and self-driving cars. Come join us in our mission to Engineer the next generation of outstanding products. Teams are dedicated to the architecture and design of CMOS and Silicon-Photonics high-speed chip interfaces (NVLink, IEEE, PCIE, USB, OIF) and other sophisticated photonic functions. Strong hands-on lab experience with silicon evaluation, debugging, characterization, and bring up.
What you will be doing:
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Work on Thermal and Structural design of Silicon Photonic designs
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Run stress simulation in optical components and fiber alignment and propose improved design of optical components.
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Set up experimental methodology for thermal validation and laser performance under different stress conditions.
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Modeling Si die-package thermo-mechanical interactions
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Solder joint fatigue and creep modeling
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Support the optical engineering and system engineering leads with the opto-mechanical system design.
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Die-package thermo-mechanical interactions in electronic packages for predicting failures during various assembly and reliability tests to recommend design, process or material changes.
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Hygroscopic stresses in electronic packages due to moisture diffusion.
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Crack propagation and interfacial delamination.
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Multifaceted simulation of wire-bonding and wire fusing process
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Thermal characterization of electronic packages (crafting thermal specification datasheets based on FE and experiments according to JEDEC standards)
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Solder joint fatigue and creep modeling
What we need to see:
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PhD in Electrical Engineering, Physics, or a similar discipline (or equivalent experience) with 15+ years of experience in a related field
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8+ years of experience in the development of silicon photonics ICs from concept to high-volume manufacturing
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Experience in product development of optics or photonic systems
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Experience in applied research on Silicon Photonic ICs and Systems
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Hands-on experience with Silicon Photonics products
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Proficient in Ansys tools
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Background with design tools and fixtures to aid in alignment, fabrication, gluing, and assembly of lasers, interferometers, and optical components
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Experience working, communicating, and collaborating in a cross-functional team environment
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Experience defining system performance and component specifications
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Excellent verbal and written communication skills
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Self-motivated and self-directed individual, with little supervision vital
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 232,000 USD - 368,000 USD.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until April 25, 2026.
This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.
NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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关于NVIDIA

NVIDIA
PublicA computing platform company operating at the intersection of graphics, HPC, and AI.
10,001+
员工数
Santa Clara
总部位置
$4.57T
企业估值
评价
10条评价
4.4
10条评价
工作生活平衡
2.8
薪酬
4.5
企业文化
4.2
职业发展
4.3
管理层
3.8
78%
推荐率
优点
Cutting-edge technology and innovation
Excellent compensation and benefits
Great team culture and collaboration
缺点
High pressure and expectations
Poor work-life balance and long hours
Fast-paced environment leading to burnout
薪资范围
79个数据点
Junior/L3
Mid/L4
Senior/L5
Junior/L3 · Analyst
7份报告
$170,275
年薪总额
基本工资
$130,981
股票
-
奖金
-
$155,480
$234,166
面试评价
5条评价
难度
3.0
/ 5
面试流程
1
Application Review
2
Recruiter Screen
3
Technical Phone Screen
4
Onsite/Virtual Interviews
5
Team Matching
6
Offer
常见问题
Coding/Algorithm
System Design
Behavioral/STAR
Technical Knowledge
Past Experience