In an increasingly connected world, the pandemic has highlighted just how essential telecom networks are to keeping society running. The Network Infrastructure group is at the heart of a revolution to connectivity, pushing the boundaries to deliver more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise​

Join Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we’ve united two industry leaders to create an optical networking powerhouse—combining cutting-edge technology with proven leadership to redefine the future of connectivity.​

Nokia is seeking a Senior/Staff High-Speed Analog IC Design R&D Engineer to create innovative products in a fast-paced and collaborative team environment. The engineer will be hands-on with all phases of R&D including product definition, circuit design, layout, verification, bring-up, DVT, qualification, test and production ramp-up. As a member of a vertically-integrated team, the engineer will be directly supporting system level customers and will be closely working with product, operations and reliability teams. The self-motivated engineer must be able to anticipate problems and devise effective solutions.

NION2026

Minimum Experience Requirements:

• Experience with High-speed analog IC designs with Si Ge Bi

CMOS or CMOS:

• Knowledge of transmission lines and other high-frequency passive structures

• A good understanding of device physics and impact on analog circuits and techniques to improve performance.

• Experience with RF wafer probing, lab equipment and evaluation of high-speed analog ICs

• Familiarity with VerilogA and CAD scripting languages (Skill, python, shell scripts) would be an asset.

• Must be a team player with good verbal and written communication skills

Education Requirements:

• BS 5+ years – MS/PhD preferred

• MS 3+ years

• PhD

• Responsible for developing > 100Gbaud ICs for future generation products

• In charge of many aspects of IC product development, such as design, layout, and bring-up.

• Work closely with verification, CAD, product and test engineering teams to devise and conduct DVT plans and characterization.