Thermal Simulation - Working Student at Nokia

Working Student is a long-term paid internship, that allows you to kickstart your fabulous journey in the IT world. As our Trainee you can have experience working in such areas that correspond to full-time jobs. We are open to flexible working hours so that you can reconcile working with us with your studies. #Open ToYou.

Position: Working Student

Thermal Simulation Duration:

12 months
Location:

Nuremberg, Germany
Education Recommendations:

Master student in Mechanical or Computational Engineering (or other relevant fields) with motivation and interest in working with thermal concepts

We are currently looking for a highly motivated professional who possess a solid technical understanding to support our team to shape the future of optical data transmission via conducting

You will work as a member of the hardware development team in our Optics R&D Center on the Air Campus in Nuremberg. The tasks would include i.a. conducting thermal simulations and verifications of complex high-speed- boards in HW-R&D.

We offer a supportive and innovative work environment, space for individual thinking and creativity, encouraging atmosphere, flexible working time with home office opportunity, competence development and career opportunities, sports and leisure time activities.

• Solid knowledge of Fluid Mechanic, Heat transfer and Thermodynamics
• Experience with thermal simulation softwares (ideally Flotherm)
• Familiarity with thermal testing and measurement equipment (sensors, thermocouples, etc.)
• Experienced with Microsoft Office applications to edit documents, handle test data and create presentations
• Strength in problem solving
• Fluent in either German or English; good command of English writing

As a working student in our HW Development Optics R&D department, you will:

• Get insights into processes of board and system level thermal design and cooling concepts of optical transmission and switching systems.
• Provide direct assistance to thermal engineers with tasks related to the thermal simulation and testing of parts, boards, and systems.
• Description, execution and analysis of thermal tests in laboratory environment.
• Conduct literature research in an application-oriented manner for the relevant topics.
• Documentation and reporting results insightfully.

Our development team focuses on all aspects of architecture, design, implementation, validation, and deployment of printed circuit boards (PCB) for high-speed optical networking applications.